212609-1

TE Connectivity AMP Connectors's 212609-1 represents the next generation of Backplane Connectors - Housings, optimized for high-density interconnect solutions. This advanced connector system delivers unparalleled performance in data center and cloud computing applications, where reliability and scalability are paramount. The innovative design addresses key challenges in signal integrity and power distribution.The Housing for Male Pins architecture enables bidirectional signal transmission while maintaining 100 differential impedance, essential for 400GbE network switches and routers.Utilizing Drawer technology, this connector achieves superior signal integrity metrics, with insertion loss below 0.5dB/inch at 28GHz for high-speed serial links.Supporting up to 4 (Power) positions, this solution meets the growing demand for higher port counts in server backplanes and storage area networks.With 1 staggered rows, this design provides optimal current distribution for power delivery networks in AI accelerator cards and GPU clusters.The Panel Mount interface ensures proper coplanarity during reflow processes, critical for achieving high first-pass yields in automated SMT assembly lines.As a Receptacle, this component features gold-plated contacts with 15 plating thickness for reliable mating cycles exceeding 10,000 insertions in telecom equipment.Enhanced with Mating Guide, the housing provides IP67-level protection against dust and moisture ingress for outdoor wireless base station deployments.The Black housing incorporates laser-markable surfaces for permanent identification in traceability systems required by medical device manufacturers.