211600-2
TE Connectivity Aerospace, Defense and Marine
211600-2
TE Connectivity Aerospace, Defense and Marine
CONN COVER DUST FOR SIZE 2 & 3
Reference Price (USD)
1+
$6.16000
500+
$6.0984
1000+
$6.0368
1500+
$5.9752
2000+
$5.9136
2500+
$5.852
Exquisite packaging
Discount
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Product details
As an innovator in Backplane Connectors - Accessories, TE Connectivity Aerospace, Defense and Marine presents 211600-2 - a quantum leap in miniaturized interconnect solutions. This micro-sized connector maintains full performance at 40GHz while occupying 60% less PCB real estate than conventional designs.
When space constraints dictate Cap (Cover), Dust selection, this product delivers exceptional density without compromising signal integrity. Its patented contact geometry reduces skin effect losses by 22% at millimeter-wave frequencies.
Tailored for ARINC 600 Series compact designs, this accessory enables direct chip-to-chip interconnection. The low-profile height (1.2mm) facilitates integration in wearable medical monitoring devices.
Available with Plastic customization options, the solution supports heterogeneous integration. The lead-free solder compatibility meets JEDEC J-STD-020 moisture sensitivity level 1 requirements for consumer electronics.
Product Attributes
- Product Status: Active
- Accessory Type: Cap (Cover), Dust
- For Use With/Related Products: ARINC 600 Series
- Specifications: Plastic