2061-903
WAGO Corporation
2061-903
WAGO Corporation
BOARD-TO-BOARD LINK; PIN SPACING
Reference Price (USD)
1+
$1.42000
500+
$1.4058
1000+
$1.3916
1500+
$1.3774
2000+
$1.3632
2500+
$1.349
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
2061-903
$1.42
Product details
The 2061-903 by WAGO Corporation is a breakthrough in Solid State Lighting Connectors, designed for next-generation data center infrastructure. This high-speed interconnect solution delivers unparalleled signal integrity with ultra-low latency, making it perfect for AI server clusters and hyperscale computing.The Board to Board architecture enables flexible backplane configurations, supporting both orthogonal and mid-plane designs. Its scalable structure allows for seamless system upgrades as bandwidth requirements evolve.Featuring Jumper technology, this interface achieves 56Gbps NRZ performance with minimal crosstalk. The innovative contact geometry reduces insertion loss by 40% compared to previous generations.Available in 3 configurations, the connector supports high-density server architectures. Each position maintains controlled impedance for consistent signal propagation across all channels.The Free Hanging (In-Line) installation method provides robust mechanical support for heavy backplane assemblies. The precision alignment features ensure proper mating even in high-vibration environments.Utilizing Poke-In technology ensures reliable connections with <1m contact resistance. The gas-tight interface prevents oxidation in humid data center conditions.The 0.236" (6.00mm) spacing optimizes signal integrity while enabling record-breaking port density. Precision molding ensures consistent performance across all positions in the array.The White housing incorporates laser-etchable surfaces for permanent identification. High-visibility coloring aids in quick fault identification during maintenance.Constructed from Copper Alloy, the contacts exhibit excellent conductivity and mechanical resilience. The specialized alloy formulation minimizes skin effect at high frequencies.The Silver surface treatment ensures stable contact resistance through 25,000 mating cycles. The selective plating process optimizes signal performance while reducing cost.Made from Polyamide (PA), Nylon 6/6, the housing demonstrates exceptional dimensional stability in thermal cycling conditions. The low-outgassing formulation meets NASA standards for cleanroom use.Rated for -60°C ~ 105°C operation, the connector maintains performance in extreme server room environments. Extensive testing confirms reliable operation through 1,000+ thermal cycles.
Product Attributes
- Product Status: Active
- Style: Board to Board
- Connector Type: Jumper
- Number of Positions: 3
- Mounting Type: Free Hanging (In-Line)
- Termination: Poke-In
- Pitch: 0.236" (6.00mm)
- Fastening Type: -
- Features: -
- Housing Color: White
- Wire Gauge: -
- Contact Material: Copper Alloy
- Contact Finish: Silver
- Housing Material: Polyamide (PA), Nylon 6/6
- Operating Temperature: -60°C ~ 105°C
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