2040661138
Molex
2040661138
Molex
CONN RCPT IMPEL 64POS PCB
Reference Price (USD)
1+
$37.50000
500+
$37.125
1000+
$36.75
1500+
$36.375
2000+
$36
2500+
$35.625
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
2040661138
$37.50
Product details
The 2040661138 by Molex revolutionizes Backplane Connectors - Specialized technology, specifically engineered for hyperscale data center applications. This high-density interconnect solution delivers unmatched signal integrity while supporting next-generation computing architectures.Specifically developed for Daughtercard implementations, this series excels in co-packaged optics interconnect applications.Featuring Receptacle, Female Sockets and Blade Sockets configuration, this connector series provides optimal performance for 224G PAM4 signaling in switch fabric applications.The Impel™ design incorporates advanced crosstalk suppression techniques, critical for maintaining eye diagram integrity in high-speed serial links.With 64 available positions, this solution enables unprecedented port density for top-of-rack switching equipment.The All loaded variant offers power-efficient solutions for partial population scenarios in server backplanes.The 0.075" (1.90mm) micro-pitch design enables breakthrough density while maintaining impedance control for 112G SerDes channels.8 row configuration supports orthogonal direct-attach copper architectures in disaggregated server designs.The 8 column architecture enables efficient routing of wide parallel buses in memory-centric computing systems.Through Hole, Right Angle installation method ensures precise coplanarity for reliable surface-mount assembly in automated PCB production lines.The Press-Fit process has been optimized for low-void solder joints in mass reflow processes per IPC-7095C standards.The 32 Differential Pairs arrangement implements optimized return current paths essential for reducing simultaneous switching noise in AI accelerator cards.Key Shielded include integrated heat spreaders and airflow-optimized housings for thermal management in high-performance computing applications.Gold plating technology provides superior wear resistance exceeding 10,000 mating cycles for data center hot-swap scenarios.30.0µin (0.76µm) coating thickness ensures compliance with IEC 60512-99-001 fretting corrosion requirements.The Black housing material incorporates laser-markable surfaces for traceability in automated manufacturing environments.
Product Attributes
- Product Status: Active
- Connector Usage: Daughtercard
- Connector Type: Receptacle, Female Sockets and Blade Sockets
- Connector Style: Impel™
- Number of Positions: 64
- Number of Positions Loaded: All
- Pitch: 0.075" (1.90mm)
- Number of Rows: 8
- Number of Columns: 8
- Mounting Type: Through Hole, Right Angle
- Termination: Press-Fit
- Contact Layout, Typical: 32 Differential Pairs
- Features: Shielded
- Contact Finish: Gold
- Contact Finish Thickness: 30.0µin (0.76µm)
- Color: Black
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