2013620-3
TE Connectivity AMP Connectors
2013620-3
TE Connectivity AMP Connectors
CONN SOCKET PGA ZIF 989POS GOLD
Reference Price (USD)
1+
$13.93000
500+
$13.7907
1000+
$13.6514
1500+
$13.5121
2000+
$13.3728
2500+
$13.2335
Exquisite packaging
Discount
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2013620-3
$13.93
Product details
TE Connectivity AMP Connectors's 2013620-3 represents the next generation of Sockets for ICs, Transistors solutions, optimized for industrial IoT applications. The innovative design incorporates multiple reliability enhancements while maintaining backward compatibility with legacy systems.The PGA, ZIF (ZIP) architecture provides unparalleled flexibility for prototype development. System designers can leverage multiple configuration options to optimize signal paths in mixed-signal circuits.Configured with 989 (35 x 36), this socket supports complex ASIC programming. The symmetrical pin distribution minimizes propagation delay variations in high-speed memory interfaces.Precision-engineered 0.039" (1.00mm) spacing prevents solder bridging during reflow. This feature is particularly valuable for miniaturized medical device manufacturing.Gold surface treatment delivers exceptional wear resistance. Accelerated aging tests show <5% contact resistance change after 1,000 thermal cycles.The 15.0µin (0.38µm) coating thickness exceeds telecom industry requirements. This ensures stable contact impedance in base station power amplifiers.Copper Alloy contact material provides optimal stress relaxation properties. Finite element analysis confirms consistent normal force throughout the product lifecycle.The Surface Mount design facilitates rapid field replacement in harsh environments. This feature reduces maintenance downtime in offshore wind turbine applications.Incorporating Open Frame, the socket prevents particulate contamination in cleanroom settings. The unique geometry meets ISO Class 5 particulate standards.Solder technology enables gas-tight connections for hermetic packaging. This is essential for aerospace avionics operating at altitude.The 0.039" (1.00mm) post arrangement supports high-current applications. Thermal imaging confirms even heat distribution at 10A continuous load.Using Copper Alloy for posts ensures compatibility with press-fit assembly. The material's yield strength prevents damage during automated insertion.Thermoplastic construction provides UV resistance for outdoor applications. The material retains 95% of tensile strength after 5,000 hours of UV exposure.
Product Attributes
- Product Status: Active
- Type: PGA, ZIF (ZIP)
- Number of Positions or Pins (Grid): 989 (35 x 36)
- Pitch - Mating: 0.039" (1.00mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 15.0µin (0.38µm)
- Contact Material - Mating: Copper Alloy
- Mounting Type: Surface Mount
- Features: Open Frame
- Termination: Solder
- Pitch - Post: 0.039" (1.00mm)
- Contact Finish - Post: -
- Contact Finish Thickness - Post: -
- Contact Material - Post: Copper Alloy
- Housing Material: Thermoplastic
- Operating Temperature: -
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