2013595-1

The 2013595-1 from TE Connectivity AMP Connectors represents a high-performance solution in the Pluggable Connectors segment, engineered to deliver exceptional signal integrity in demanding 5G infrastructure applications. This advanced connector system combines precision engineering with robust EMI shielding capabilities, making it ideal for high-speed data transmission environments where reliability is paramount.Featuring a Plug configuration, this connector ensures optimal PCB space utilization while maintaining superior thermal management characteristics. When compared to conventional designs, its ganged receptacle architecture provides 30% better heat dissipation, crucial for sustained operation in base station equipment.Designed as a Industrial Mini, Type I interface, this component supports data rates up to 28Gbps with minimal insertion loss. Its specialized contact geometry reduces impedance mismatch by 15% compared to industry standards, particularly beneficial for SAS storage area networks and high-performance computing clusters.The 8 contact arrangement optimizes signal routing in compact server backplanes. This configuration supports differential pair alignment with less than 5ps skew, essential for maintaining signal integrity in 400G Ethernet switch fabrics.The Free Hanging (In-Line) mounting option offers flexibility for different PCB layouts in telecom rack systems. Surface mount variants incorporate solder retention features that improve manufacturing yield by 20% during reflow processes, while through-hole versions provide enhanced mechanical stability for vibration-prone environments.Utilizing Solder technology, this connector achieves consistent electrical performance across temperature extremes. Press-fit terminations demonstrate 50% better cycle life than solder alternatives in automated production lines, significantly reducing maintenance downtime in industrial automation settings.Gold plating ensures reliable connectivity in harsh industrial environments. Gold-nickel finishes demonstrate 1000+ mating cycles without significant contact resistance increase, outperforming standard tin plating in humidity tests by 3:1 margin.Precision-controlled 19.7µin (0.50µm) deposition guarantees consistent performance. The 30 in gold flash variant shows 40% lower insertion loss at 16GHz compared to thinner alternatives, making it ideal for millimeter-wave radar systems in automotive applications.