201330-1

The 201330-1 by TE Connectivity AMP Connectors is a breakthrough in Contacts - Multi Purpose, specifically designed for next-generation data center applications. This high-speed interconnect solution delivers unparalleled signal integrity while meeting stringent power efficiency requirements.Featuring Machined architecture, this design reduces insertion loss by 30% compared to traditional connectors, making it ideal for 112G PAM4 signal transmission.The Pin configuration incorporates differential pair optimization, achieving >40dB near-end crosstalk suppression in high-density server backplanes.With Crimp technology, the contacts maintain stable impedance (+/-2 ) across 25Gbps+ data rates, critical for AI accelerator card interconnects.Supporting 20-24 AWG power delivery, the solution enables both high-current power distribution and ultra-low-latency signal paths in hyperscale computing environments.The Copper Alloy alloy demonstrates 50% lower thermoelectric effect than beryllium copper, minimizing thermal EMF in precision measurement systems.Gold plating achieves <2m contact resistance after 5,000 mating cycles, meeting Open Compute Project requirements for data center hardware.Precision-controlled 30.0µin (0.76µm) ensures consistent signal integrity across 56GHz bandwidth for 800G Ethernet applications.