2007852-3
TE Connectivity AMP Connectors
2007852-3
TE Connectivity AMP Connectors
CONN HEADER IMPACT 150POS PCB
Reference Price (USD)
1+
$11.60658
500+
$11.4905142
1000+
$11.3744484
1500+
$11.2583826
2000+
$11.1423168
2500+
$11.026251
Exquisite packaging
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2007852-3
$11.61
Product details
The 2007852-3 by TE Connectivity AMP Connectors revolutionizes Backplane Connectors - Specialized technology, specifically engineered for hyperscale data center applications. This high-density interconnect solution delivers unmatched signal integrity while supporting next-generation computing architectures.Specifically developed for Backplane implementations, this series excels in co-packaged optics interconnect applications.Featuring Header, Male Pins configuration, this connector series provides optimal performance for 224G PAM4 signaling in switch fabric applications.The Impact design incorporates advanced crosstalk suppression techniques, critical for maintaining eye diagram integrity in high-speed serial links.With 150 available positions, this solution enables unprecedented port density for top-of-rack switching equipment.The All loaded variant offers power-efficient solutions for partial population scenarios in server backplanes.The 0.075" (1.91mm) micro-pitch design enables breakthrough density while maintaining impedance control for 112G SerDes channels.15 row configuration supports orthogonal direct-attach copper architectures in disaggregated server designs.The 10 column architecture enables efficient routing of wide parallel buses in memory-centric computing systems.Through Hole installation method ensures precise coplanarity for reliable surface-mount assembly in automated PCB production lines.The Press-Fit process has been optimized for low-void solder joints in mass reflow processes per IPC-7095C standards.The 100 Signal, 50 Ground arrangement implements optimized return current paths essential for reducing simultaneous switching noise in AI accelerator cards.Gold plating technology provides superior wear resistance exceeding 10,000 mating cycles for data center hot-swap scenarios.30.0µin (0.76µm) coating thickness ensures compliance with IEC 60512-99-001 fretting corrosion requirements.The Black housing material incorporates laser-markable surfaces for traceability in automated manufacturing environments.
Product Attributes
- Product Status: Active
- Connector Usage: Backplane
- Connector Type: Header, Male Pins
- Connector Style: Impact
- Number of Positions: 150
- Number of Positions Loaded: All
- Pitch: 0.075" (1.91mm)
- Number of Rows: 15
- Number of Columns: 10
- Mounting Type: Through Hole
- Termination: Press-Fit
- Contact Layout, Typical: 100 Signal, 50 Ground
- Features: -
- Contact Finish: Gold
- Contact Finish Thickness: 30.0µin (0.76µm)
- Color: Black
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