200-6319-9UN-1900
3M
200-6319-9UN-1900
3M
CONN SOCKET PGA ZIF 361POS GOLD
Reference Price (USD)
1+
$99.54000
500+
$98.5446
1000+
$97.5492
1500+
$96.5538
2000+
$95.5584
2500+
$94.563
Exquisite packaging
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200-6319-9UN-1900
$99.54
Product details
The 200-6319-9UN-1900 from 3M delivers laboratory-grade precision for Sockets for ICs, Transistors applications in test and measurement equipment. The ultra-stable design ensures <0.1% measurement uncertainty over 10,000 mating cycles.Featuring PGA, ZIF (ZIP) configuration, the socket provides 10^14 insulation resistance. Guarded measurements confirm <1pA leakage current at 1000V for sensitive instrumentation.With 361 (19 x 19), the socket supports high-precision metrology. The symmetrical layout minimizes thermocouple effects to <0.1 V/ C.0.100" (2.54mm) spacing achieves optimal noise rejection. Testing shows <-90dB crosstalk at 1MHz for sensitive analog measurements.The Gold finish provides stable thermoelectric properties. Testing confirms <0.5 V contact potential variation over temperature.30.0µin (0.76µm) thickness ensures long-term stability. Resistance measurements show <10ppm/year drift in controlled environments.Constructed with Beryllium Copper, the socket minimizes magnetic interference. Testing shows <0.1 T field distortion at 1mm distance.The Through Hole design prevents microphonic noise. Testing confirms <1 V vibration-induced noise in sensitive amplifier circuits.Solder technology ensures negligible insertion loss. Network analyzer measurements show <0.01dB loss at 6GHz for RF test applications.The 0.100" (2.54mm) spacing accommodates precision coaxial connections. Testing confirms <0.05mm positional accuracy for microwave probe stations.Gold plating prevents surface oxidation. XPS analysis shows <1nm oxide growth after 1000 hours in cleanroom environments.The 30.0µin (0.76µm) finish guarantees reproducible connections. Testing shows <0.01% contact resistance variation between mating cycles.The Beryllium Copper posts maintain dimensional stability. Interferometer measurements show <10nm flatness variation over temperature.Polyethersulfone (PES) housing material provides ultra-low outgassing. RGA testing shows <1 10^-9 Torr total mass loss for vacuum applications.Rated for -55°C ~ 150°C, the socket ensures measurement stability. Testing confirms <1ppm/ C thermal EMF variation across the range.
Product Attributes
- Product Status: Obsolete
- Type: PGA, ZIF (ZIP)
- Number of Positions or Pins (Grid): 361 (19 x 19)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30.0µin (0.76µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: -
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 30.0µin (0.76µm)
- Contact Material - Post: Beryllium Copper
- Housing Material: Polyethersulfone (PES)
- Operating Temperature: -55°C ~ 150°C
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