20-101-1196

The 20-101-1196 from Digi represents a cutting-edge solution in the Embedded - Microcontroller, Microprocessor, FPGA Modules segment, engineered for high-performance embedded systems. This module combines advanced signal processing capabilities with robust power efficiency, making it ideal for 5G infrastructure and edge computing applications where low-latency operation is critical.Featuring a versatile MPU Core architecture, this component delivers exceptional flexibility for multi-core processing tasks. When compared to conventional designs, its hybrid FPGA-MPU configuration enables superior parallel computation while maintaining precise clock synchronization across all cores.At the heart of the system lies the Rabbit 3000, optimized for real-time digital signal processing with its advanced pipeline architecture. The processor's instruction set acceleration ensures deterministic execution cycles, crucial for industrial automation timing constraints.Operating at 44.2MHz, the module achieves industry-leading performance-per-watt metrics. This clock frequency has been carefully validated to maintain signal integrity while minimizing electromagnetic interference in dense PCB layouts.With 512KB (Internal), 32MB (External), microSD Slot (External) of non-volatile memory, the device offers ample storage for firmware and configuration data. The flash memory subsystem incorporates error correction codes (ECC) to ensure data reliability in mission-critical aerospace applications.The 1MB high-speed memory supports demanding multi-threaded operations. Its low-latency access architecture is particularly effective for buffering high-bandwidth sensor data in autonomous driving systems.The 2 IDC Headers 2x17, 1 IDC Header 2x5, 1xmicroSD Card interface provides robust mechanical and electrical connections, developed for vibration-resistant industrial environments. Its impedance-matched design preserves signal quality even in extended cable runs common in factory automation.Measuring just 1.85" x 2.73" (47mm x 69mm), this compact form factor enables high-density installations. The precision-engineered package maintains thermal performance characteristics essential for medical imaging equipment.Rated for -20°C ~ 85°C, the module delivers reliable operation in extreme conditions. This temperature resilience, combined with conformal coating options, makes it suitable for outdoor IoT deployments in harsh climates.