20-0517-90C
Aries Electronics
20-0517-90C
Aries Electronics
CONN SOCKET SIP 20POS GOLD
Reference Price (USD)
1+
$8.53214
500+
$8.4468186
1000+
$8.3614972
1500+
$8.2761758
2000+
$8.1908544
2500+
$8.105533
Exquisite packaging
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20-0517-90C
$8.53
Product details
Aries Electronics's 20-0517-90C redefines reliability standards for Sockets for ICs, Transistors components in medical imaging systems. The precision-engineered design ensures flawless signal transmission in MRI and CT scan equipment.The SIP architecture provides superior EMI shielding effectiveness. Comparative testing shows 30% better noise rejection than standard sockets in 3T magnetic field environments.With 20 (1 x 20) configuration, this socket enables high-density analog front-end designs. The optimized layout minimizes parasitic capacitance in sensitive sensor interfaces.Featuring Gold finish, the socket maintains stable contact resistance in sterile environments. Testing shows <0.5m variation after 500 autoclave cycles at 134 C.The 30.0µin (0.76µm) coating thickness exceeds medical device requirements. Accelerated aging tests predict 10-year reliability in hospital equipment.Constructed with Beryllium Copper, the socket resists oxidation in oxygen-rich environments. Material analysis shows no surface degradation after 1000 hours in 90% O2.The Through Hole, Right Angle design facilitates quick replacement in surgical robotics. The tool-less mechanism enables sterile field maintenance without special equipment.Solder technology ensures gas-tight seals for hermetic medical packages. Helium leak testing verifies <1 10^-9 atm cc/s leak rates.Tin plating prevents biocontamination. Antimicrobial testing shows >99.9% reduction in bacterial growth after 24 hours.The 200.0µin (5.08µm) finish ensures reliable connections after repeated sterilization. Testing shows no degradation after 1000 steam sterilization cycles.The Brass posts maintain mechanical properties after radiation sterilization. Testing confirms full functionality after 50kGy gamma irradiation.Polyamide (PA46), Nylon 4/6, Glass Filled housing material meets USP Class VI biocompatibility standards. The material shows zero cytotoxic effects in elution testing.
Product Attributes
- Product Status: Active
- Type: SIP
- Number of Positions or Pins (Grid): 20 (1 x 20)
- Pitch - Mating: -
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30.0µin (0.76µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole, Right Angle
- Features: -
- Termination: Solder
- Pitch - Post: -
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 200.0µin (5.08µm)
- Contact Material - Post: Brass
- Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
- Operating Temperature: -
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