2-2822979-3
TE Connectivity AMP Connectors
2-2822979-3
TE Connectivity AMP Connectors
CONN SOCKET LGA 3647POS GOLD
Reference Price (USD)
1+
$65.72000
500+
$65.0628
1000+
$64.4056
1500+
$63.7484
2000+
$63.0912
2500+
$62.434
Exquisite packaging
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2-2822979-3
$65.72
Product details
TE Connectivity AMP Connectors's 2-2822979-3 enables next-generation Sockets for ICs, Transistors solutions for quantum computing applications. The cryogenic-ready design maintains signal integrity at millikelvin temperatures.The LGA architecture provides ultra-low thermal conductivity. Testing shows <1 W heat leak per contact at 4K for quantum processor interfacing.With 3647, the socket supports complex qubit control. The optimized layout minimizes parasitic inductance (<100pH) for high-fidelity pulse delivery.0.039" (1.00mm) spacing prevents crosstalk in sensitive measurements. Testing shows <-80dB isolation at 10GHz for quantum state readout.Featuring Gold finish, the socket maintains superconductive properties. Resistance measurements show <10^-8 contact resistance at 4.2K.The 30.0µin (0.76µm) coating ensures thermal matching. CTE measurements show <1ppm/K difference to silicon substrates.Constructed with Copper Alloy, the socket minimizes magnetic susceptibility. SQUID measurements show <10^-8 emu/g at 4K.The Surface Mount design facilitates dilution refrigerator integration. Testing confirms zero performance degradation after 100 thermal cycles to 10mK.Incorporating Open Frame, the socket provides microwave shielding. Testing shows >60dB attenuation up to 40GHz for qubit protection.Solder technology ensures minimal thermal noise. Johnson noise measurements show <0.1nV/ Hz contribution at 4K.The 0.034" (0.86mm) spacing accommodates superconducting wiring. Critical current testing confirms >100mA per contact at 4.2K.Gold plating prevents oxidation in ultra-high vacuum. XPS analysis shows <0.1nm oxide after 1000 hours at 10^-10 Torr.The 30.0µin (0.76µm) finish ensures reliable connections in vacuum. Testing shows no outgassing products detectable by RGA.The Copper Alloy posts maintain mechanical properties at cryogenic temperatures. Testing shows <0.1% elastic modulus change from 300K to 4K.Thermoplastic housing material provides radiopure construction. Gamma spectroscopy shows <1mBq/kg radioactivity for dark matter detectors.
Product Attributes
- Product Status: Active
- Type: LGA
- Number of Positions or Pins (Grid): 3647
- Pitch - Mating: 0.039" (1.00mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30.0µin (0.76µm)
- Contact Material - Mating: Copper Alloy
- Mounting Type: Surface Mount
- Features: Open Frame
- Termination: Solder
- Pitch - Post: 0.034" (0.86mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 30.0µin (0.76µm)
- Contact Material - Post: Copper Alloy
- Housing Material: Thermoplastic
- Operating Temperature: -
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