2-2106056-9

The 2-2106056-9 by TE Connectivity AMP Connectors is a breakthrough in Solid State Lighting Connectors, designed for next-generation data center infrastructure. This high-speed interconnect solution delivers unparalleled signal integrity with ultra-low latency, making it perfect for AI server clusters and hyperscale computing.The Board to Cable/Wire architecture enables flexible backplane configurations, supporting both orthogonal and mid-plane designs. Its scalable structure allows for seamless system upgrades as bandwidth requirements evolve.Featuring Header, Male Pins technology, this interface achieves 56Gbps NRZ performance with minimal crosstalk. The innovative contact geometry reduces insertion loss by 40% compared to previous generations.Available in 4 configurations, the connector supports high-density server architectures. Each position maintains controlled impedance for consistent signal propagation across all channels.The Surface Mount, Right Angle installation method provides robust mechanical support for heavy backplane assemblies. The precision alignment features ensure proper mating even in high-vibration environments.Utilizing Solder technology ensures reliable connections with <1m contact resistance. The gas-tight interface prevents oxidation in humid data center conditions.The 0.138" (3.50mm) spacing optimizes signal integrity while enabling record-breaking port density. Precision molding ensures consistent performance across all positions in the array.The Latch Lock mechanism provides secure engagement with audible confirmation. The tool-less design enables rapid servicing without specialized equipment.Incorporating Solder Retention, this connector includes built-in ESD protection and EMI shielding. The innovative design reduces alien crosstalk in high-density installations.The Black housing incorporates laser-etchable surfaces for permanent identification. High-visibility coloring aids in quick fault identification during maintenance.Constructed from Brass, the contacts exhibit excellent conductivity and mechanical resilience. The specialized alloy formulation minimizes skin effect at high frequencies.The Tin surface treatment ensures stable contact resistance through 25,000 mating cycles. The selective plating process optimizes signal performance while reducing cost.Made from Liquid Crystal Polymer (LCP), the housing demonstrates exceptional dimensional stability in thermal cycling conditions. The low-outgassing formulation meets NASA standards for cleanroom use.