2-1542009-7
TE Connectivity AMP Connectors
2-1542009-7
TE Connectivity AMP Connectors
RETENTION MODULE W/HARDWARE
Reference Price (USD)
1+
$0.00000
500+
$0
1000+
$0
1500+
$0
2000+
$0
2500+
$0
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
2-1542009-7
$0.00
Product details
The 2-1542009-7 from TE Connectivity AMP Connectors delivers precision thermal management for medical devices in the Thermal - Heat Sinks category. Designed for reliability in life-critical applications, this solution combines biocompatible materials with exceptional thermal performance for imaging and diagnostic equipment.The Board Level Extrusion design provides EMI shielding compatibility crucial for sensitive medical electronics. The integrated grounding features reduce RF interference by 25dB compared to standard designs.Medical-grade Thermal Tape allows non-conductive attachment meeting IEC 60601-1 leakage current requirements. The adhesive maintains bond strength after 100+ autoclave cycles at 134 C.Rectangular Fins configuration achieves {Thermal Resistance @ Forced Air Flow} in laminar airflow environments. The streamlined design prevents particulate accumulation per ISO 14644 Class 5 cleanroom standards.The 3.520" (89.41mm) dimension fits standard medical cart footprints while providing sufficient thermal mass for pulsed power loads. The design minimizes eddy currents in MRI environments.With 3.000" (76.20mm) coverage, the solution cools multi-channel sensor arrays without thermal crosstalk. Infrared thermography shows less than 1 C variation across critical components.Precision 1.180" (29.97mm) ensures compatibility with medical device airflow restrictions (typically <0.5m/s). The fin density is optimized for silent operation (<20dB) in patient care environments.
Product Attributes
- Product Status: Active
- Type: Board Level
- Package Cooled: -
- Attachment Method: Bolt On
- Shape: Rectangular
- Length: 3.520" (89.41mm)
- Width: 3.000" (76.20mm)
- Diameter: -
- Fin Height: 1.180" (29.97mm)
- Power Dissipation @ Temperature Rise: -
- Thermal Resistance @ Forced Air Flow: -
- Thermal Resistance @ Natural: -
- Material: -
- Material Finish: -
You May Also Be Interested In