2-1542003-2
TE Connectivity AMP Connectors
2-1542003-2
TE Connectivity AMP Connectors
HEAT SINK BGA 23MM 2FIN RADIAL
Reference Price (USD)
1+
$21.21000
500+
$20.9979
1000+
$20.7858
1500+
$20.5737
2000+
$20.3616
2500+
$20.1495
Exquisite packaging
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2-1542003-2
$21.21
Product details
The 2-1542003-2 by TE Connectivity AMP Connectors delivers military-grade reliability in the Thermal - Heat Sinks category for satellite communications. This space-qualified thermal solution combines exceptional performance with the ruggedness required for orbital and terrestrial extreme environments.Engineered for GaN RF power amplifiers, the solution handles {Power Dissipation @ Temperature Rise} in vacuum conditions. The thermal interface maintains stable performance across 500+ thermal cycles from -150 C to +125 C.The Flexure Mount system compensates for CTE mismatches in composite satellite structures. The design maintains thermal contact pressure within 10% across the full operational temperature range.Spiral Fin configuration delivers {Thermal Resistance @ Natural} in omnidirectional radiation environments. The geometry maximizes surface area while minimizing molecular contamination risk.For cylindrical transceiver modules, the 1.375" (34.92mm) OD variant provides complete 360 thermal coupling. The design maintains contact pressure in microgravity environments.Optimized 0.357" (9.07mm) ensures effective radiation cooling in vacuum conditions. The black anodized surface maintains emissivity >0.95 after prolonged UV exposure.The 7.20°C/W @ 200 LFM performance is qualified for terrestrial use in desert environments. The design prevents sand ingress while maintaining cooling performance.The 13.40°C/W specification enables passive thermal control in spacecraft applications. The design maintains components within operational limits using only radiation cooling.Aluminum 6061-T6 with Type III hard anodize meets MIL-A-8625 requirements. The material outgassing characteristics comply with NASA ASTM E595 standards.Black Anodized surface treatment provides optimal emissivity (0.92) for radiative cooling. The finish withstands atomic oxygen exposure in LEO environments.
Product Attributes
- Product Status: Active
- Type: -
- Package Cooled: BGA
- Attachment Method: Clip
- Shape: Cylindrical
- Length: -
- Width: -
- Diameter: 1.375" (34.92mm) OD
- Fin Height: 0.357" (9.07mm)
- Power Dissipation @ Temperature Rise: -
- Thermal Resistance @ Forced Air Flow: 7.20°C/W @ 200 LFM
- Thermal Resistance @ Natural: 13.40°C/W
- Material: Aluminum
- Material Finish: Black Anodized
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