2-1437530-9
TE Connectivity AMP Connectors
2-1437530-9
TE Connectivity AMP Connectors
CONN SOCKET SIP 12POS
Reference Price (USD)
1+
$0.00000
500+
$0
1000+
$0
1500+
$0
2000+
$0
2500+
$0
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
2-1437530-9
$0.00
Product details
TE Connectivity AMP Connectors's 2-1437530-9 redefines reliability standards for Sockets for ICs, Transistors components in medical imaging systems. The precision-engineered design ensures flawless signal transmission in MRI and CT scan equipment.The SIP architecture provides superior EMI shielding effectiveness. Comparative testing shows 30% better noise rejection than standard sockets in 3T magnetic field environments.With 12 (1 x 12) configuration, this socket enables high-density analog front-end designs. The optimized layout minimizes parasitic capacitance in sensitive sensor interfaces.0.100" (2.54mm) spacing achieves optimal signal integrity for low-noise applications. Network analyzer measurements confirm <-70dB crosstalk at 10GHz for RF signal chains.Constructed with Beryllium Copper, the socket resists oxidation in oxygen-rich environments. Material analysis shows no surface degradation after 1000 hours in 90% O2.The Through Hole design facilitates quick replacement in surgical robotics. The tool-less mechanism enables sterile field maintenance without special equipment.Solder technology ensures gas-tight seals for hermetic medical packages. Helium leak testing verifies <1 10^-9 atm cc/s leak rates.The 0.100" (2.54mm) spacing accommodates high-voltage medical applications. Dielectric testing confirms 5kV isolation for patient-connected equipment.The Beryllium Copper posts maintain mechanical properties after radiation sterilization. Testing confirms full functionality after 50kGy gamma irradiation.Thermoplastic housing material meets USP Class VI biocompatibility standards. The material shows zero cytotoxic effects in elution testing.
Product Attributes
- Product Status: Active
- Type: SIP
- Number of Positions or Pins (Grid): 12 (1 x 12)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: -
- Contact Finish Thickness - Mating: -
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: -
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: -
- Contact Finish Thickness - Post: -
- Contact Material - Post: Beryllium Copper
- Housing Material: Thermoplastic
- Operating Temperature: -
You May Also Be Interested In