1SX280HU2F50I2VGAS
Intel
1SX280HU2F50I2VGAS
Intel
IC FPGA STRATIX 10 2397FBGA
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Product details
Intel's 1SX280HU2F50I2VGAS redefines Embedded - System On Chip (SoC) technology for professional audio equipment. Optimized for studio-grade signal processing, this SoC combines ultra-low distortion analog paths with powerful DSP capabilities, making 1SX280HU2F50I2VGAS the preferred choice for digital mixers and audio interfaces where pristine signal quality is essential.The MCU, FPGA architecture features parallel DSP cores with dedicated audio processing accelerators for real-time effects processing.The Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ core delivers the computational density needed for multi-channel audio processing with sample-accurate synchronization.With 256KB of high-fidelity RAM, the processor maintains zero-wait-state performance for audio buffer processing.Audio-specific DMA, WDT include high-dynamic-range ADCs/DACs and professional digital audio interfaces.The EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG suite supports all major audio networking protocols while maintaining strict jitter performance.Operating at 1.5GHz, the processor meets the real-time requirements of high-channel-count audio systems.FPGA - 2800K Logic Elements include hardware-accelerated floating-point processing for studio-quality effects algorithms.Designed for -40°C ~ 100°C (TJ) operation, the component maintains stable performance in demanding studio environments.The 2397-BBGA, FCBGA package provides optimal EMI shielding for noise-sensitive audio applications.Available in 2397-FBGA, FC (50x50), the device meets professional audio equipment reliability standards.
Product Attributes
- Product Status: Active
- Architecture: MCU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.5GHz
- Primary Attributes: FPGA - 2800K Logic Elements
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 2397-BBGA, FCBGA
- Supplier Device Package: 2397-FBGA, FC (50x50)
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