1963841-2
TE Connectivity AMP Connectors
1963841-2
TE Connectivity AMP Connectors
QSFP SINGLE PCI EXTRUSION HS 4
Reference Price (USD)
1+
$3.60778
500+
$3.5717022
1000+
$3.5356244
1500+
$3.4995466
2000+
$3.4634688
2500+
$3.427391
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
1963841-2
$3.61
Product details
Optimized for automotive electronics, the 1963841-2 by TE Connectivity AMP Connectors sets new standards in Thermal - Heat Sinks reliability. This AEC-Q200 qualified thermal solution addresses unique challenges in electric vehicle power systems, combining robust construction with exceptional thermal performance.The Top Mount Skived design provides precise flatness ( 0.05mm/m ) required for automotive power modules. The manufacturing process eliminates internal stresses that could lead to micro-cracking in vibration environments.Specifically engineered for IGBT and TE0600 packages, the solution manages {Power Dissipation @ Temperature Rise} under hood temperatures reaching 125 C. The thermal interface maintains integrity across 1000+ thermal shock cycles (-40 C to +150 C).The Bolt On system meets automotive vibration requirements (ISO 16750-3) while allowing for serviceability. The titanium hardware resists galvanic corrosion in wet environments.Square Pin Fins configuration delivers {Thermal Resistance @ Forced Air Flow} in turbulent underhood airflow. The staggered pin arrangement reduces boundary layer thickness by 18% compared to linear fins.The 1.801" (45.74mm) dimension accommodates standard automotive ECU footprints. Crash simulations confirm the design withstands 50g impacts without compromising thermal contact.With 0.738" (18.75mm) coverage, the solution cools multiple power devices simultaneously. The copper-tungsten base plate prevents thermal runaway in parallel configurations.Optimized 0.165" (4.20mm) ensures compatibility with confined spaces in electric vehicle battery management systems. The design prevents fin resonance at common engine vibration frequencies.
Product Attributes
- Product Status: Active
- Type: Board Level
- Package Cooled: QSFP
- Attachment Method: Adhesive
- Shape: Rectangular, Pin Fins
- Length: 1.801" (45.74mm)
- Width: 0.738" (18.75mm)
- Diameter: -
- Fin Height: 0.165" (4.20mm)
- Power Dissipation @ Temperature Rise: -
- Thermal Resistance @ Forced Air Flow: -
- Thermal Resistance @ Natural: -
- Material: -
- Material Finish: -
You May Also Be Interested In