19-7650-10
Aries Electronics
19-7650-10
Aries Electronics
CONN SOCKET SIP 19POS TIN
Reference Price (USD)
1+
$14.99875
500+
$14.8487625
1000+
$14.698775
1500+
$14.5487875
2000+
$14.3988
2500+
$14.2488125
Exquisite packaging
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19-7650-10
$15.00
Product details
Aries Electronics's 19-7650-10 redefines reliability standards for Sockets for ICs, Transistors components in medical imaging systems. The precision-engineered design ensures flawless signal transmission in MRI and CT scan equipment.The SIP architecture provides superior EMI shielding effectiveness. Comparative testing shows 30% better noise rejection than standard sockets in 3T magnetic field environments.With 19 (1 x 19) configuration, this socket enables high-density analog front-end designs. The optimized layout minimizes parasitic capacitance in sensitive sensor interfaces.0.100" (2.54mm) spacing achieves optimal signal integrity for low-noise applications. Network analyzer measurements confirm <-70dB crosstalk at 10GHz for RF signal chains.Featuring Tin finish, the socket maintains stable contact resistance in sterile environments. Testing shows <0.5m variation after 500 autoclave cycles at 134 C.The 200.0µin (5.08µm) coating thickness exceeds medical device requirements. Accelerated aging tests predict 10-year reliability in hospital equipment.Constructed with Phosphor Bronze, the socket resists oxidation in oxygen-rich environments. Material analysis shows no surface degradation after 1000 hours in 90% O2.The Through Hole design facilitates quick replacement in surgical robotics. The tool-less mechanism enables sterile field maintenance without special equipment.Incorporating Elevated, the socket prevents particulate generation. Testing confirms compliance with ISO 14644-1 Class 4 cleanroom standards.Solder technology ensures gas-tight seals for hermetic medical packages. Helium leak testing verifies <1 10^-9 atm cc/s leak rates.The 0.100" (2.54mm) spacing accommodates high-voltage medical applications. Dielectric testing confirms 5kV isolation for patient-connected equipment.Tin plating prevents biocontamination. Antimicrobial testing shows >99.9% reduction in bacterial growth after 24 hours.The 200.0µin (5.08µm) finish ensures reliable connections after repeated sterilization. Testing shows no degradation after 1000 steam sterilization cycles.The Phosphor Bronze posts maintain mechanical properties after radiation sterilization. Testing confirms full functionality after 50kGy gamma irradiation.Polyamide (PA46), Nylon 4/6, Glass Filled housing material meets USP Class VI biocompatibility standards. The material shows zero cytotoxic effects in elution testing.Rated for -55°C ~ 105°C, the socket performs reliably in cryogenic applications. Testing confirms operation from -196 C to +150 C for liquid nitrogen environments.
Product Attributes
- Product Status: Active
- Type: SIP
- Number of Positions or Pins (Grid): 19 (1 x 19)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Tin
- Contact Finish Thickness - Mating: 200.0µin (5.08µm)
- Contact Material - Mating: Phosphor Bronze
- Mounting Type: Through Hole
- Features: Elevated
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 200.0µin (5.08µm)
- Contact Material - Post: Phosphor Bronze
- Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
- Operating Temperature: -55°C ~ 105°C
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