189853F00000

The 189853F00000 by Aavid, Thermal Division of Boyd Corporation sets new benchmarks in Thermal - Pads, Sheets technology for automotive electronics. This ruggedized thermal solution combines exceptional durability with industry-leading thermal performance, making it ideal for under-hood applications and electric vehicle power systems.Engineered specifically for TIP requirements, this thermal pad maintains performance under mechanical vibration and thermal shock conditions. Its unique composition resists pump-out effects common in dynamic automotive environments.As a high-performance Pad, Sheet, this product offers superior conformability to irregular surfaces. The viscoelastic properties ensure maximum interface contact even with components exhibiting surface warpage or roughness.Manufactured in precision Rectangular configurations, this material facilitates efficient thermal pathway design. The optimized geometries minimize thermal impedance while accommodating space constraints in compact automotive modules.Standard 21.97mm x 16.51mm dimensions ensure compatibility with common power electronics packaging. The size-optimized design allows for efficient thermal management without requiring custom tooling.The precisely controlled 0.0070" (0.178mm) provides optimal balance between thermal transfer and mechanical compliance. This characteristic is particularly valuable in applications requiring vibration damping alongside thermal management.Formulated with advanced Silicone technology, this pad exhibits exceptional resistance to automotive fluids and chemicals. This property ensures long-term reliability in harsh operating environments.Featuring Adhesive - One Side properties, this solution offers reliable component bonding under extreme conditions. The high-temperature resistant formulation maintains adhesion integrity throughout the product lifecycle.The Gray identification system enables quick visual verification during quality inspections. This feature is particularly valuable in high-volume manufacturing environments.