1825-02

Pomona Electronics's 1825-02 establishes new performance thresholds in Banana and Tip Connectors - Jacks, Plugs technology, specifically designed for quantum computing cryogenic environments. Its superconducting materials maintain <10n contact resistance at 4K temperatures.This Banana Plug, Stackable implementation utilizes niobium-titanium alloy contacts that achieve zero insertion force mating at cryogenic temperatures. The monolithic design eliminates thermal contraction mismatches in dilution refrigerator setups.The Male variant features gold-plated beryllium copper springs that retain elasticity down to 1K. The non-magnetic construction prevents interference with sensitive SQUID magnetometers.Machined to Standard Banana tolerances with <0.1 m surface roughness, the interface maintains <0.05dB insertion loss at 10GHz. The ultra-high vacuum compatibility reaches <10-9 Torr operational pressure.Engineered for Free Hanging (In-Line) installation, the connector incorporates indium seals that maintain helium leak rates <10-8 cc/s. The G10/CR epoxy laminate meets NASA outgassing requirements.The Solderless method employs superconducting wire bonds that achieve <1nV thermal EMF. The diffusion-welded joints demonstrate <0.01% resistance variation during thermal cycling from 300K to 4K.Non-Mating End Insulated materials exhibit <0.1% dielectric loss tangent at millikelvin temperatures. The alumina-filled PTFE construction maintains mechanical stability across 400 C temperature differentials.The Set Screw, Safety Collar package includes integrated heaters for controlled thermal cycling. The gold-plated molybdenum radiation shields reduce thermal loading in ultra-high vacuum systems.Black, Red identification uses infrared-reflective coatings for thermal management. The spectrally selective surfaces maintain <0.2 emissivity in cryogenic radiation environments.Designed for 18-22 AWG superconducting wiring, the strain relief system prevents critical current degradation. The vespel-insulated pass-throughs minimize heat leak in multi-stage cryostats.