1766192-1

TE Connectivity AMP Connectors's 1766192-1 sets the benchmark in Backplane Connectors - Contacts for data center infrastructure. Designed for high-density server applications, this connector supports 112G PAM4 signaling with excellent return loss characteristics below -30dB up to 16GHz.The Power implementation features patented crosstalk cancellation technology that improves signal-to-noise ratio by 15dB. System architects benefit from its backward compatibility with existing 56G NRZ architectures.Featuring Pin configuration with anti-stubbing design, the connector enables blind mating in rack-mounted equipment. The floating contact mechanism compensates for 0.5mm alignment tolerances.The Crimp process utilizes laser-cleaned surfaces prior to termination, achieving oxide-free connections. This method reduces insertion loss variation to less than 0.1dB across 10,000 mating cycles.Engineered for 8 AWG high-speed cables, the impedance matching is maintained within 5% of 100 differential. The controlled skew design ensures <5ps/m pair-to-pair delay variation.Silver surface treatment incorporates nanoscale roughness control for optimal signal reflection. Measurements confirm surface roughness (Ra) remains below 0.1 m throughout the product lifecycle.Precision-controlled 200.0µin (5.08µm) deposition achieves skin depth optimization at 28GHz. The thickness uniformity is verified through automated optical inspection with 99.9% process capability.