1731140984

The 1731140984 by Molex sets new benchmarks in D-Sub, D-Shaped Connectors - Backshells, Hoods technology for quantum computing applications. This ultra-precision backshell system maintains signal purity at cryogenic temperatures while minimizing thermal loads.Designed as a Two Piece Backshell, this component provides exceptional thermal isolation while preventing microphonic interference that could disrupt qubit coherence times.Supporting 3 (Power) positions, the configuration enables high-density control line routing for multi-qubit processors without introducing parasitic capacitance.Optimized for Round superconducting wiring, the strain-free termination preserves signal integrity during thermal cycling between 300K and 10mK operating temperatures.The 180° orientation minimizes heat leakage paths in dilution refrigerator installations while allowing for precise cable management in constrained cold volumes.Featuring Shielded construction, the backshell attenuates external magnetic fields by 60dB at 1GHz, critical for maintaining qubit isolation in noisy laboratory environments.The Metal composition meets NASA outgassing standards (ASTM E595) for use in sensitive quantum measurement systems.Fabricated from Zinc Die Cast, the housing exhibits near-zero thermal contraction mismatch with common cryostat materials while preventing outgassing in ultra-high vacuum environments.The Nickel surface treatment maintains stable contact resistance below 1n at cryogenic temperatures, essential for precision bias current delivery.Complete with Assembly Hardware, Cable Clamp, Strain Relief, the assembly maintains mechanical stability during rapid cooldown cycles from room temperature to 4K without introducing microphonic noise.Incorporating Mating Screws, the design enables rapid experimental reconfiguration while maintaining alignment tolerances within 5 m for microwave feedthrough applications.The Silver finish provides visual contrast for optical alignment systems while absorbing minimal infrared radiation that could heat sensitive components.