1731120647
Molex
1731120647
Molex
CONN D-SUB PIN CRIMP GOLD
Reference Price (USD)
1+
$2.57735
500+
$2.5515765
1000+
$2.525803
1500+
$2.5000295
2000+
$2.474256
2500+
$2.4484825
Exquisite packaging
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1731120647
$2.58
Product details
Molex's 1731120647 redefines D-Sub, D-Shaped Connectors - Contacts technology for quantum computing applications. These ultra-precision contacts maintain signal integrity at cryogenic temperatures while minimizing thermal conductivity.Specialized for Power quantum bit control systems, the contacts demonstrate <0.1dB insertion loss at 4K temperatures. Comparative testing shows 50% lower thermal load than conventional cryogenic interconnects.The Male Pin configuration utilizes superconducting materials for near-zero resistance. The patented geometry achieves <10n contact resistance at 10mA bias current.Crimp methods are validated for dilution refrigerator environments. The indium-based system demonstrates 1000+ reliable thermal cycles without performance degradation.The Gold surface treatment prevents oxidation in ultra-high vacuum. Auger electron spectroscopy confirms <5 oxide layer after 1000 hours at 10^-10 Torr.With 31.5µin (0.80µm) deposition, the contacts achieve stable thermal emf characteristics. Testing shows <0.1 V/K thermal voltage at cryogenic temperatures.Gold plating provides excellent bonding for superconducting joints. The finish composition enables critical current densities exceeding 10^5 A/cm .Atomic-level controlled 8.00µin (0.203µm) ensures consistent performance across quantum arrays. Statistical analysis shows <1% variation in contact properties across 1000 units.
Product Attributes
- Product Status: Active
- Type: Power
- Contact Type: Male Pin
- Contact Form: -
- Wire Gauge: -
- Contact Termination: Crimp
- Contact Material: -
- Contact Finish: Gold
- Contact Finish Thickness: 31.5µin (0.80µm)
- Termination Finish: Gold
- Termination Finish Thickness: 8.00µin (0.203µm)
- Contact Size: -
- Features: -
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