1731120172
Molex
1731120172
Molex
CONN D-SUB PIN COAX GOLD
Reference Price (USD)
1+
$11.65400
500+
$11.53746
1000+
$11.42092
1500+
$11.30438
2000+
$11.18784
2500+
$11.0713
Exquisite packaging
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1731120172
$11.65
Product details
Molex's 1731120172 redefines D-Sub, D-Shaped Connectors - Contacts technology for quantum computing applications. These ultra-precision contacts maintain signal integrity at cryogenic temperatures while minimizing thermal conductivity.Specialized for Coaxial quantum bit control systems, the contacts demonstrate <0.1dB insertion loss at 4K temperatures. Comparative testing shows 50% lower thermal load than conventional cryogenic interconnects.The Male Pin, Right Angle configuration utilizes superconducting materials for near-zero resistance. The patented geometry achieves <10n contact resistance at 10mA bias current.Cryo-optimized Machined technology prevents microphonic noise generation. Each contact undergoes helium leak testing to verify <10^-9 mbar l/s leak rates.Engineered for RG-174, 188, 316 superconducting wiring, the contacts maintain mechanical stability during thermal contraction. Testing confirms <0.01% dimensional change from 300K to 4K.Crimp and Solder methods are validated for dilution refrigerator environments. The indium-based system demonstrates 1000+ reliable thermal cycles without performance degradation.Selected Copper Alloy composition exhibits near-zero magnetoresistance. Material characterization confirms <1ppm magnetic susceptibility at 10T fields.The Gold surface treatment prevents oxidation in ultra-high vacuum. Auger electron spectroscopy confirms <5 oxide layer after 1000 hours at 10^-10 Torr.With 51.2µin (1.30µm) Inner, 31.5µin (0.80µm) Outer deposition, the contacts achieve stable thermal emf characteristics. Testing shows <0.1 V/K thermal voltage at cryogenic temperatures.Gold plating provides excellent bonding for superconducting joints. The finish composition enables critical current densities exceeding 10^5 A/cm .Atomic-level controlled 51.2µin (1.30µm) Inner, 8.00µin (0.203µm) Outer ensures consistent performance across quantum arrays. Statistical analysis shows <1% variation in contact properties across 1000 units.
Product Attributes
- Product Status: Active
- Type: Coaxial
- Contact Type: Male Pin, Right Angle
- Contact Form: Machined
- Wire Gauge: RG-174, 188, 316
- Contact Termination: Crimp and Solder
- Contact Material: Copper Alloy
- Contact Finish: Gold
- Contact Finish Thickness: 51.2µin (1.30µm) Inner, 31.5µin (0.80µm) Outer
- Termination Finish: Gold
- Termination Finish Thickness: 51.2µin (1.30µm) Inner, 8.00µin (0.203µm) Outer
- Contact Size: -
- Features: -
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