1731120079
Molex
1731120079
Molex
CONN D-SUB PIN PCB GOLD
Reference Price (USD)
1+
$3.69000
500+
$3.6531
1000+
$3.6162
1500+
$3.5793
2000+
$3.5424
2500+
$3.5055
Exquisite packaging
Discount
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1731120079
$3.69
Product details
Molex's 1731120079 redefines D-Sub, D-Shaped Connectors - Contacts technology for quantum computing applications. These ultra-precision contacts maintain signal integrity at cryogenic temperatures while minimizing thermal conductivity.Specialized for Power quantum bit control systems, the contacts demonstrate <0.1dB insertion loss at 4K temperatures. Comparative testing shows 50% lower thermal load than conventional cryogenic interconnects.The Male Pin, Right Angle configuration utilizes superconducting materials for near-zero resistance. The patented geometry achieves <10n contact resistance at 10mA bias current.Cryo-optimized Machined technology prevents microphonic noise generation. Each contact undergoes helium leak testing to verify <10^-9 mbar l/s leak rates.Solder, PCB methods are validated for dilution refrigerator environments. The indium-based system demonstrates 1000+ reliable thermal cycles without performance degradation.Selected Copper Alloy composition exhibits near-zero magnetoresistance. Material characterization confirms <1ppm magnetic susceptibility at 10T fields.The Gold surface treatment prevents oxidation in ultra-high vacuum. Auger electron spectroscopy confirms <5 oxide layer after 1000 hours at 10^-10 Torr.With 31.5µin (0.80µm) deposition, the contacts achieve stable thermal emf characteristics. Testing shows <0.1 V/K thermal voltage at cryogenic temperatures.Tin plating provides excellent bonding for superconducting joints. The finish composition enables critical current densities exceeding 10^5 A/cm .Atomic-level controlled 200.0µin (5.08µm) ensures consistent performance across quantum arrays. Statistical analysis shows <1% variation in contact properties across 1000 units.
Product Attributes
- Product Status: Active
- Type: Power
- Contact Type: Male Pin, Right Angle
- Contact Form: Machined
- Wire Gauge: -
- Contact Termination: Solder, PCB
- Contact Material: Copper Alloy
- Contact Finish: Gold
- Contact Finish Thickness: 31.5µin (0.80µm)
- Termination Finish: Tin
- Termination Finish Thickness: 200.0µin (5.08µm)
- Contact Size: -
- Features: -
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