1727040135
Molex
1727040135
Molex
CONN D-SUB SOCKET 20AWG SLDR CUP
Reference Price (USD)
1+
$6.21000
500+
$6.1479
1000+
$6.0858
1500+
$6.0237
2000+
$5.9616
2500+
$5.8995
Exquisite packaging
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1727040135
$6.21
Product details
Molex's 1727040135 redefines D-Sub, D-Shaped Connectors - Contacts technology for quantum computing applications. These ultra-precision contacts maintain signal integrity at cryogenic temperatures while minimizing thermal conductivity.Specialized for Voltage quantum bit control systems, the contacts demonstrate <0.1dB insertion loss at 4K temperatures. Comparative testing shows 50% lower thermal load than conventional cryogenic interconnects.The Female Socket configuration utilizes superconducting materials for near-zero resistance. The patented geometry achieves <10n contact resistance at 10mA bias current.Cryo-optimized Machined technology prevents microphonic noise generation. Each contact undergoes helium leak testing to verify <10^-9 mbar l/s leak rates.Engineered for 20 AWG superconducting wiring, the contacts maintain mechanical stability during thermal contraction. Testing confirms <0.01% dimensional change from 300K to 4K.Solder Cup methods are validated for dilution refrigerator environments. The indium-based system demonstrates 1000+ reliable thermal cycles without performance degradation.Selected Copper Alloy composition exhibits near-zero magnetoresistance. Material characterization confirms <1ppm magnetic susceptibility at 10T fields.The Gold surface treatment prevents oxidation in ultra-high vacuum. Auger electron spectroscopy confirms <5 oxide layer after 1000 hours at 10^-10 Torr.With 51.2µin (1.30µm) deposition, the contacts achieve stable thermal emf characteristics. Testing shows <0.1 V/K thermal voltage at cryogenic temperatures.The Insulator, PTFE integration minimizes parasitic capacitance in qubit control lines. Network analyzer measurements confirm <0.1pF stray capacitance at 10GHz.
Product Attributes
- Product Status: Active
- Type: Voltage
- Contact Type: Female Socket
- Contact Form: Machined
- Wire Gauge: 20 AWG
- Contact Termination: Solder Cup
- Contact Material: Copper Alloy
- Contact Finish: Gold
- Contact Finish Thickness: 51.2µin (1.30µm)
- Termination Finish: -
- Termination Finish Thickness: -
- Contact Size: -
- Features: Insulator, PTFE
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