172-050-213R051

NorComp Inc.

General info

Part Number

172-050-213R051

Manufacturer

NorComp Inc.

Description:

50P // F // VT // NICKEL // 05

Reference Price (USD)

$15.00150

500+

$14.851485

1000+

$14.70147

1500+

$14.551455

2000+

$14.40144

2500+

$14.251425

Exquisite packaging

Discount

TT / Paypal / Credit Card / Western Union / Money Gram

172-050-213R051

$15.00

Product details

Optimized for automotive Ethernet applications, NorComp Inc.'s 172-050-213R051 D-Sub Connectors delivers Category 5e performance in compact form factors. The innovative shielding design reduces EMI emissions by 18dB while supporting 1Gbps data rates.The D-Sub profile incorporates chamfered edges for tool-less mating in space-constrained vehicle harness assemblies.Receptacle, Female Sockets contacts feature dual-fork geometry that maintains <50m resistance after 25,000 vibration cycles per USCAR-2.The 50 layout separates power and signal contacts with integrated transient voltage suppressors rated for 40A surge.Precision-molded 3 dielectric bodies maintain impedance within 5 of nominal 100 differential pairs.Panel Mount, Through Hole configuration includes integrated PCB stiffeners that reduce flex-induced solder joint stress by 70%.The 5 (DD, D) design features 12-point grounding contacts that maintain <10nH inductance up to 6GHz.Signal implementation uses nanocrystalline alloys that exhibit <3% resistance change from -40 C to +125 C.The Board Side (4-40) system incorporates conductive elastomer gaskets that maintain shielding integrity during 2mm panel misalignment.Our Solder methodology creates intermetallic bonds that survive 1000 thermal cycles from -55 C to +125 C.The Metal formulation uses laser-direct-structured (LDS) thermoplastics for integrated antenna applications.Steel, Nickel Plated provides >1000-hour corrosion resistance in GM9540P cyclic corrosion testing.The Gold surface treatment demonstrates <5% wear after 25,000 mating cycles per EIA-364-09.Precision-controlled Flash ensures proper noble metal diffusion barrier formation during extended thermal aging.All materials exceed UL94 V-0 requirements without red phosphorus additives for cleaner combustion.The 5A design incorporates current-sharing parallel paths that reduce thermal hot spots by 40%.Board Lock include integrated magnetics for 100Base-T1 applications with <1.5dB insertion loss at 100MHz.