1713351807
Molex
1713351807
Molex
CONN HEADER IMPEL PCB
Reference Price (USD)
1+
$15.31000
500+
$15.1569
1000+
$15.0038
1500+
$14.8507
2000+
$14.6976
2500+
$14.5445
Exquisite packaging
Discount
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1713351807
$15.31
Product details
The 1713351807 from Molex represents a cutting-edge solution in Backplane Connectors - Specialized, engineered for high-density backplane applications requiring exceptional signal integrity. This advanced connector system combines robust construction with precision engineering to deliver reliable performance in mission-critical environments.Designed specifically for Backplane applications, this product series delivers proven performance in high-speed digital systems up to 56Gbps NRZ.With Header, Male Pins and Blades configuration, this component ensures optimal mating compatibility while maintaining superior electrical characteristics. The hermaphroditic contact design enhances assembly flexibility in complex systems.Featuring Impel™ technology, the connector achieves industry-leading contact reliability, particularly beneficial for high-vibration environments found in industrial automation equipment.When configured with All loaded positions, the connector offers customizable solutions for power distribution networks without compromising signal path density.With 0.075" (1.90mm) centerline spacing, the design achieves optimal balance between high-density packaging and manufacturability requirements.The 9 row configuration enables three-dimensional backplane stacking, particularly valuable in data center orthogonal interconnect architectures.The 8 column arrangement supports wide bus architectures while maintaining controlled impedance characteristics across all signal paths.The Through Hole mounting option facilitates both standard and high-reliability PCB attachment methods, with proven performance in through-hole reflow processes.Press-Fit methods provide flexibility for both automated assembly processes and field-serviceable connections in telecom infrastructure.The 24 Differential Pairs arrangement optimizes impedance matching while providing balanced power delivery - crucial for maintaining signal integrity in 5G base station applications.Incorporating Shielded, this connector system addresses EMI shielding requirements while providing positive latching mechanisms essential for vibration-resistant installations.Gold plating ensures durable contact surfaces capable of withstanding multiple mating cycles, meeting MIL-STD-202H standards for harsh environment operation.The 30.0µin (0.76µm) coating thickness exceeds industry standards for corrosion resistance, ensuring long-term reliability in humid operating conditions.
Product Attributes
- Product Status: Active
- Connector Usage: Backplane
- Connector Type: Header, Male Pins and Blades
- Connector Style: Impel™
- Number of Positions: -
- Number of Positions Loaded: All
- Pitch: 0.075" (1.90mm)
- Number of Rows: 9
- Number of Columns: 8
- Mounting Type: Through Hole
- Termination: Press-Fit
- Contact Layout, Typical: 24 Differential Pairs
- Features: Shielded
- Contact Finish: Gold
- Contact Finish Thickness: 30.0µin (0.76µm)
- Color: -
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