166051-1
TE Connectivity AMP Connectors
166051-1
TE Connectivity AMP Connectors
CONN D-SUB SOCKET 20-24AWG CRIMP
Reference Price (USD)
1+
$0.75000
500+
$0.7425
1000+
$0.735
1500+
$0.7275
2000+
$0.72
2500+
$0.7125
Exquisite packaging
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166051-1
$0.75
Product details
TE Connectivity AMP Connectors's 166051-1 redefines D-Sub, D-Shaped Connectors - Contacts technology for quantum computing applications. These ultra-precision contacts maintain signal integrity at cryogenic temperatures while minimizing thermal conductivity.Specialized for Signal quantum bit control systems, the contacts demonstrate <0.1dB insertion loss at 4K temperatures. Comparative testing shows 50% lower thermal load than conventional cryogenic interconnects.The Female Socket configuration utilizes superconducting materials for near-zero resistance. The patented geometry achieves <10n contact resistance at 10mA bias current.Cryo-optimized Stamped technology prevents microphonic noise generation. Each contact undergoes helium leak testing to verify <10^-9 mbar l/s leak rates.Engineered for 20-24 AWG superconducting wiring, the contacts maintain mechanical stability during thermal contraction. Testing confirms <0.01% dimensional change from 300K to 4K.Crimp methods are validated for dilution refrigerator environments. The indium-based system demonstrates 1000+ reliable thermal cycles without performance degradation.Selected Phosphor Bronze composition exhibits near-zero magnetoresistance. Material characterization confirms <1ppm magnetic susceptibility at 10T fields.The Gold surface treatment prevents oxidation in ultra-high vacuum. Auger electron spectroscopy confirms <5 oxide layer after 1000 hours at 10^-10 Torr.With 30.0µin (0.76µm) deposition, the contacts achieve stable thermal emf characteristics. Testing shows <0.1 V/K thermal voltage at cryogenic temperatures.Tin plating provides excellent bonding for superconducting joints. The finish composition enables critical current densities exceeding 10^5 A/cm .The 20 DF geometry supports high-density qubit addressing with 50 m pitch capability. Cryogenic SEM imaging confirms zero mechanical deformation at 4K operating temperatures.The Insulation Support integration minimizes parasitic capacitance in qubit control lines. Network analyzer measurements confirm <0.1pF stray capacitance at 10GHz.
Product Attributes
- Product Status: Active
- Type: Signal
- Contact Type: Female Socket
- Contact Form: Stamped
- Wire Gauge: 20-24 AWG
- Contact Termination: Crimp
- Contact Material: Phosphor Bronze
- Contact Finish: Gold
- Contact Finish Thickness: 30.0µin (0.76µm)
- Termination Finish: Tin
- Termination Finish Thickness: -
- Contact Size: 20 DF
- Features: Insulation Support
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