165X10819XE

The 165X10819XE by Conec is a cutting-edge D-Sub, D-Shaped Connectors - Backshells, Hoods solution designed for next-generation data center infrastructure. This high-density backshell system ensures flawless signal transmission while optimizing rack space utilization in hyperscale computing environments.As a One Piece Backshell, this component provides thermal management capabilities that reduce connector operating temperatures by up to 15 C compared to conventional designs, crucial for maintaining signal integrity in high-speed SERDES applications.Featuring 9 contact positions, the configuration supports 400G Ethernet implementations with ample room for future bandwidth expansion in spine-leaf architectures.Optimized for Round cable assemblies, the patented strain relief system prevents signal degradation even when subjected to repeated cable manipulations during server maintenance.The 30° orientation enables efficient cable routing in constrained rack spaces while maintaining proper airflow for thermal management of adjacent components.With Shielded construction, the backshell achieves 100dB EMI suppression at 10GHz, essential for preventing crosstalk in dense server configurations running PCIe 5.0 interfaces.Fabricated from Metal, Zinc, the housing demonstrates exceptional dimensional stability with less than 0.1% deformation under continuous 85 C/85% RH conditions per Telcordia GR-1217.The Nickel surface treatment ensures 100 mating cycles with contact resistance stability within 2m , meeting stringent requirements for hot-swappable server connections.Complete with Assembly Hardware, the assembly withstands vibration levels up to 5Grms per NEBS GR-63-CORE requirements for carrier-grade installations.Incorporating Cover, the design facilitates blind-mate installation in dark data center environments while providing positive tactile feedback for technician confirmation.The Silver finish incorporates laser-markable surfaces for permanent equipment identification while maintaining UL 94 V-0 flame rating.