160-PGM15050-10
Aries Electronics
160-PGM15050-10
Aries Electronics
CONN SOCKET PGA GOLD
Reference Price (USD)
1+
$20.63667
500+
$20.4303033
1000+
$20.2239366
1500+
$20.0175699
2000+
$19.8112032
2500+
$19.6048365
Exquisite packaging
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160-PGM15050-10
$20.64
Product details
The 160-PGM15050-10 from Aries Electronics delivers cutting-edge performance for Sockets for ICs, Transistors applications in industrial robotics. Designed for 24/7 operation, this socket combines reliability with precision engineering.Featuring PGA configuration, the socket enables rapid tool changing in automated assembly lines. The design reduces changeover time by 40% compared to threaded connectors.0.100" (2.54mm) spacing ensures signal integrity in noisy environments. Testing confirms immunity to 10V/m RF interference per IEC 61000-4-3.With Gold finish, the socket maintains low contact resistance. Testing under 10G vibration shows <1m variation during continuous operation.The 10.0µin (0.25µm) coating withstands abrasive contaminants. Testing with ISO 12103-A3 dust shows no measurable wear after 1 million cycles.Beryllium Copper contacts provide exceptional fatigue resistance. The material withstands >100,000 insertion cycles without performance degradation.The Through Hole design facilitates maintenance in confined spaces. The tool-less design enables single-handed operation in robotic work cells.Solder technology ensures reliable connections in moving assemblies. The design maintains electrical continuity during continuous flexing motions.The 0.100" (2.54mm) spacing accommodates high-voltage isolation requirements. Dielectric testing confirms 4kV withstand voltage for industrial equipment safety.Tin plating prevents fretting corrosion. Testing under 50 m amplitude vibration shows no measurable contact degradation.The 200.0µin (5.08µm) finish ensures reliable connections in corrosive environments. Testing in 5% salt fog shows no contact degradation after 500 hours.The Brass posts maintain dimensional stability. Thermal expansion testing shows <0.01% dimensional change across the operating range.Polyamide (PA46), Nylon 4/6, Glass Filled construction provides impact resistance. The material withstands 2J impacts without cracking or deformation.Rated for -55°C ~ 105°C, the socket performs reliably in foundry environments. The design maintains functionality despite rapid temperature changes.
Product Attributes
- Product Status: Active
- Type: PGA
- Number of Positions or Pins (Grid): -
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 10.0µin (0.25µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: -
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 200.0µin (5.08µm)
- Contact Material - Post: Brass
- Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
- Operating Temperature: -55°C ~ 105°C
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