156-PLS16011-12
Aries Electronics
156-PLS16011-12
Aries Electronics
CONN SOCKET PGA ZIF GOLD
Reference Price (USD)
1+
$102.52000
500+
$101.4948
1000+
$100.4696
1500+
$99.4444
2000+
$98.4192
2500+
$97.394
Exquisite packaging
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156-PLS16011-12
$102.52
Product details
The 156-PLS16011-12 from Aries Electronics delivers cutting-edge performance for Sockets for ICs, Transistors applications in industrial robotics. Designed for 24/7 operation, this socket combines reliability with precision engineering.Featuring PGA, ZIF (ZIP) configuration, the socket enables rapid tool changing in automated assembly lines. The design reduces changeover time by 40% compared to threaded connectors.0.100" (2.54mm) spacing ensures signal integrity in noisy environments. Testing confirms immunity to 10V/m RF interference per IEC 61000-4-3.With Gold finish, the socket maintains low contact resistance. Testing under 10G vibration shows <1m variation during continuous operation.The 30.0µin (0.76µm) coating withstands abrasive contaminants. Testing with ISO 12103-A3 dust shows no measurable wear after 1 million cycles.Beryllium Copper contacts provide exceptional fatigue resistance. The material withstands >100,000 insertion cycles without performance degradation.The Through Hole design facilitates maintenance in confined spaces. The tool-less design enables single-handed operation in robotic work cells.Incorporating Closed Frame, the socket resists chemical exposure. Testing confirms compatibility with cutting fluids, lubricants, and industrial cleaners.Solder technology ensures reliable connections in moving assemblies. The design maintains electrical continuity during continuous flexing motions.The 0.100" (2.54mm) spacing accommodates high-voltage isolation requirements. Dielectric testing confirms 4kV withstand voltage for industrial equipment safety.Tin plating prevents fretting corrosion. Testing under 50 m amplitude vibration shows no measurable contact degradation.The 200.0µin (5.08µm) finish ensures reliable connections in corrosive environments. Testing in 5% salt fog shows no contact degradation after 500 hours.The Beryllium Copper posts maintain dimensional stability. Thermal expansion testing shows <0.01% dimensional change across the operating range.Polyphenylene Sulfide (PPS) construction provides impact resistance. The material withstands 2J impacts without cracking or deformation.Rated for -65°C ~ 125°C, the socket performs reliably in foundry environments. The design maintains functionality despite rapid temperature changes.
Product Attributes
- Product Status: Active
- Type: PGA, ZIF (ZIP)
- Number of Positions or Pins (Grid): -
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30.0µin (0.76µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 200.0µin (5.08µm)
- Contact Material - Post: Beryllium Copper
- Housing Material: Polyphenylene Sulfide (PPS)
- Operating Temperature: -65°C ~ 125°C
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