1542198-4
TE Connectivity AMP Connectors
1542198-4
TE Connectivity AMP Connectors
SALEABLE PACKAGED VERSION
Reference Price (USD)
1+
$10.57436
500+
$10.4686164
1000+
$10.3628728
1500+
$10.2571292
2000+
$10.1513856
2500+
$10.045642
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
1542198-4
$10.57
Product details
The 1542198-4 from TE Connectivity AMP Connectors represents cutting-edge thermal management in the Thermal - Heat Sinks category. Engineered for high-performance computing applications, this solution delivers exceptional heat dissipation while maintaining compact form factors. With advanced materials engineering and precision manufacturing, it sets new benchmarks for thermal efficiency in demanding environments.The Top Mount design ensures optimal contact pressure distribution, critical for BGA and LGA package cooling. When compared to traditional skived designs, this extrusion-type heatsink reduces thermal interface resistance by up to 15%.The Square Fins configuration maximizes surface area-to-volume ratio, achieving {Thermal Resistance @ Forced Air Flow} at minimal airflow. Computational fluid dynamics analysis confirms 20% better laminar flow characteristics than rectangular alternatives.The 1.375" (34.92mm) OD specification accommodates cylindrical heat sources common in power electronics. The concentric fin arrangement ensures uniform radial heat distribution.Precision-engineered 0.837" (21.26mm) creates optimal boundary layer separation, enhancing convective heat transfer. This parameter is particularly crucial for natural convection cooling scenarios.
Product Attributes
- Product Status: Active
- Type: Top Mount
- Package Cooled: -
- Attachment Method: -
- Shape: Cylindrical
- Length: -
- Width: -
- Diameter: 1.375" (34.92mm) OD
- Fin Height: 0.837" (21.26mm)
- Power Dissipation @ Temperature Rise: -
- Thermal Resistance @ Forced Air Flow: -
- Thermal Resistance @ Natural: -
- Material: -
- Material Finish: -
You May Also Be Interested In