14-8625-31
Aries Electronics
14-8625-31
Aries Electronics
CONN HDR DIP SOLDER 14POS GOLD
Reference Price (USD)
1+
$9.06538
500+
$8.9747262
1000+
$8.8840724
1500+
$8.7934186
2000+
$8.7027648
2500+
$8.612111
Exquisite packaging
Discount
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14-8625-31
$9.07
Product details
Aries Electronics's 14-8625-31 represents the gold standard in Rectangular Connectors - Headers, Specialty Pin technology, optimized for next-generation 5G infrastructure. This advanced interconnect solution combines millimeter-wave performance with ruggedized construction for outdoor base station deployments.The DIP, DIL - Header architecture supports 25Gbps data rates when implemented with matched impedance PCB layouts.Utilizing Solder Cup contact geometry, the design minimizes skin effect losses at microwave frequencies up to 40GHz.Scalable from 14 positions, the connector family addresses diverse MIMO antenna array configurations.Precision 0.100" (2.54mm) alignment enables error-free blind mating in rack-mounted RF equipment installations.Dual-row (2 rows) configuration reduces connector footprint by 40% compared to traditional designs.Engineered with 0.800" (20.32mm) spacing, the design maintains 50 characteristic impedance across all channels.Through Hole variant features integrated shielding cans for EMI suppression in dense cellular radio units.Solder process achieves <0.5dB insertion loss variance across production batches.Gold surface treatment prevents fretting corrosion in high-humidity environments.The 10.0µin (0.25µm) coating withstands 500+ thermal shock cycles from -55 C to 125 C.Black housing material demonstrates <0.1% water absorption for marine electronics applications.
Product Attributes
- Product Status: Active
- Connector Type: DIP, DIL - Header
- Contact Type: Solder Cup
- Number of Positions: 14
- Pitch: 0.100" (2.54mm)
- Number of Rows: 2
- Row Spacing: 0.800" (20.32mm)
- Mounting Type: Through Hole
- Termination: Solder
- Features: -
- Contact Finish: Gold
- Contact Finish Thickness: 10.0µin (0.25µm)
- Color: Black
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