133-7.5B9
Wakefield-Vette
133-7.5B9
Wakefield-Vette
HEATSINK EXTRUDED
Reference Price (USD)
1+
$0.00000
500+
$0
1000+
$0
1500+
$0
2000+
$0
2500+
$0
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
133-7.5B9
$0.00
Product details
Wakefield-Vette's 133-7.5B9 delivers breakthrough thermal performance for data center applications in the Thermal - Heat Sinks category. Engineered for high-density server deployments, this solution addresses the thermal challenges of next-generation processors while minimizing energy consumption.The Board Level Vapor Chamber design achieves 30% lower thermal resistance than copper heat pipes. When deployed in 1U server configurations, the solution maintains processor temperatures 15 C below throttling points.The Load Plate system provides uniform pressure distribution (75 5N) across the entire package area. The design prevents PCB warpage in multi-layer server motherboards.Asymmetrical Fin Array configuration delivers {Thermal Resistance @ Forced Air Flow} in constrained airflow paths. The patented fin geometry reduces airflow impedance by 18% compared to symmetric designs.The 7.500" (190.50mm) dimension fits standard 19 rack server footprints while allowing for optimal airflow management. Computational fluid dynamics confirms no hot spot formation in rack-level simulations.With 7.000" (177.80mm) coverage, the solution accommodates dual-processor configurations without thermal interference. Thermal imaging shows less than 2 C variation between adjacent CPUs.Precision 3.125" (79.38mm) ensures compatibility with 40mm high-speed fans (15,000 RPM). The fin density is optimized for acoustic performance (<35dBA at 1m distance).The 0.09°C/W @ 500 LFM performance is validated under ASHRAE TC9.9 Class A3 conditions. The design maintains stability at airflow rates from 10-25 CFM.The 0.28°C/W specification enables emergency operation during cooling system failures. The design maintains processors below 90 C for 15 minutes without airflow.Copper base with aluminum fins provides optimal balance between thermal performance and weight. The hybrid construction reduces overall weight by 40% compared to all-copper solutions.Nickel-plated surface ensures long-term reliability in data center environments. The finish resists sulfurization and maintains emissivity >0.85 after 5 years of operation.
Product Attributes
- Product Status: Active
- Type: Board Level
- Package Cooled: -
- Attachment Method: Bolt On
- Shape: Rectangular, Fins
- Length: 7.500" (190.50mm)
- Width: 7.000" (177.80mm)
- Diameter: -
- Fin Height: 3.125" (79.38mm)
- Power Dissipation @ Temperature Rise: -
- Thermal Resistance @ Forced Air Flow: 0.09°C/W @ 500 LFM
- Thermal Resistance @ Natural: 0.28°C/W
- Material: Aluminum Alloy
- Material Finish: Black Anodized
You May Also Be Interested In