130522

The 130522 from TE Connectivity AMP Connectors revolutionizes Terminals - Spade Connectors performance for quantum computing applications. This cryogenic-rated connector maintains signal integrity at 4K temperatures while providing ultra-low noise characteristics. Its innovative design addresses the unique challenges of superconducting circuit interconnects.Featuring Standard architecture, this connector minimizes thermal conductivity while maintaining RF shielding. The non-magnetic design prevents flux trapping in sensitive quantum circuits.Precision-engineered to M2.5 Stud specifications, this interface maintains 50 impedance at millikelvin temperatures. The superconducting contacts exhibit zero DC resistance.With 0.217" (5.50mm) dimensions, this connector enables high-density qubit interconnections. The atomic-level smooth edges prevent vortex formation in superconducting materials.The 0.772" (19.61mm) profile incorporates thermal breaks that reduce heat leakage by 99%. This feature is critical for maintaining cryogenic stability.Designed for Free Hanging (In-Line) installations in dilution refrigerators, this connector survives repeated thermal cycling. The differential contraction design prevents mechanical stress.Utilizing Crimp technology, this connector achieves superconducting joints without thermal emf. The indium-based process is compatible with niobium-titanium circuits.Optimized for 16-22 AWG cryogenic wiring, this terminal maintains signal coherence for qubit control. The coaxial design provides 100dB isolation at 10GHz.The Insulated material exhibits negligible dielectric loss at quantum frequencies. Special amorphous polymers prevent two-level system noise.The Red coding follows quantum computing lab standards for quick identification. This system reduces setup time in complex cryogenic systems.Tin plating provides stable contact resistance from 300K to 10mK. The non-stick coating prevents cold welding during thermal cycles.The Copper formulation offers perfect lattice matching for superconducting films. Advanced intermetallics prevent proximity effect losses.