13-0513-11
Aries Electronics
13-0513-11
Aries Electronics
CONN SOCKET SIP 13POS GOLD
Reference Price (USD)
1+
$3.46636
500+
$3.4316964
1000+
$3.3970328
1500+
$3.3623692
2000+
$3.3277056
2500+
$3.293042
Exquisite packaging
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13-0513-11
$3.47
Product details
Aries Electronics's 13-0513-11 sets new benchmarks for Sockets for ICs, Transistors components in renewable energy systems. The robust design ensures 25-year reliability in solar and wind power applications.The SIP architecture provides lightning surge protection. Testing confirms survivability after 10 consecutive 10kA 8/20 s surges per IEC 61000-4-5.With 13 (1 x 13), the socket enables high-current power conversion. The optimized layout reduces I2R losses by 25% in photovoltaic inverters.0.100" (2.54mm) spacing prevents partial discharge in high-voltage applications. Testing shows no PD activity below 2.5kV in humid conditions.Featuring Gold finish, the socket resists sulfur corrosion. Testing in H2S environments shows no degradation after 1000 hours.The 10.0µin (0.25µm) coating withstands UV degradation. Accelerated weathering tests predict 25-year performance in direct sunlight.Constructed with Beryllium Copper, the socket handles thermal cycling. Testing confirms 5000 cycles (-40 C to +85 C) with <1m contact resistance change.The Through Hole design resists wind-induced vibration. Testing confirms no loosening after 10^7 cycles at 0.5mm amplitude.Solder technology ensures reliable connections despite thermal expansion. Testing confirms <0.1mm movement during 100 C temperature swings.The 0.100" (2.54mm) spacing accommodates heavy busbar connections. Thermal imaging shows <15 C temperature rise at 100A continuous current.Gold plating prevents fretting in vibrating environments. Testing shows <2m change after 10^8 micro-motions.The 10.0µin (0.25µm) finish ensures reliable connections despite thermal cycling. Testing shows no degradation after 1000 -40 C/+105 C cycles.The Brass posts resist stress relaxation. Testing confirms <3% contact force loss after 25 years at 70 C.Polyamide (PA46), Nylon 4/6, Glass Filled housing material provides tracking resistance. The material achieves CTI 600 for high-pollution environments.
Product Attributes
- Product Status: Active
- Type: SIP
- Number of Positions or Pins (Grid): 13 (1 x 13)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 10.0µin (0.25µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: -
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 10.0µin (0.25µm)
- Contact Material - Post: Brass
- Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
- Operating Temperature: -
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