127782
Wakefield-Vette
127782
Wakefield-Vette
3.375" X 36" H STYLE HEATSINK 17
Reference Price (USD)
1+
$389.01000
500+
$385.1199
1000+
$381.2298
1500+
$377.3397
2000+
$373.4496
2500+
$369.5595
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
127782
$389.01
Product details
Wakefield-Vette's 127782 delivers breakthrough thermal performance for data center applications in the Thermal - Heat Sinks category. Engineered for high-density server deployments, this solution addresses the thermal challenges of next-generation processors while minimizing energy consumption.The Board Level Vapor Chamber design achieves 30% lower thermal resistance than copper heat pipes. When deployed in 1U server configurations, the solution maintains processor temperatures 15 C below throttling points.The Load Plate system provides uniform pressure distribution (75 5N) across the entire package area. The design prevents PCB warpage in multi-layer server motherboards.Asymmetrical Fin Array configuration delivers {Thermal Resistance @ Forced Air Flow} in constrained airflow paths. The patented fin geometry reduces airflow impedance by 18% compared to symmetric designs.The 36.000" (914.40mm) dimension fits standard 19 rack server footprints while allowing for optimal airflow management. Computational fluid dynamics confirms no hot spot formation in rack-level simulations.With 3.750" (95.25mm) coverage, the solution accommodates dual-processor configurations without thermal interference. Thermal imaging shows less than 2 C variation between adjacent CPUs.Precision 9.000" (228.60mm) ensures compatibility with 40mm high-speed fans (15,000 RPM). The fin density is optimized for acoustic performance (<35dBA at 1m distance).The 0.15°C/W specification enables emergency operation during cooling system failures. The design maintains processors below 90 C for 15 minutes without airflow.Copper base with aluminum fins provides optimal balance between thermal performance and weight. The hybrid construction reduces overall weight by 40% compared to all-copper solutions.
Product Attributes
- Product Status: Active
- Type: Board Level, Extrusion
- Package Cooled: -
- Attachment Method: Bolt On
- Shape: Rectangular, Fins
- Length: 36.000" (914.40mm)
- Width: 3.750" (95.25mm)
- Diameter: -
- Fin Height: 9.000" (228.60mm)
- Power Dissipation @ Temperature Rise: -
- Thermal Resistance @ Forced Air Flow: -
- Thermal Resistance @ Natural: 0.15°C/W
- Material: Aluminum
- Material Finish: -
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