126785
Wakefield-Vette
Product details
Wakefield-Vette's 126785 delivers breakthrough performance in Thermal - Heat Pipes, Vapor Chambers solutions. Tailored for high-density electronics cooling, this thermal management system combines advanced materials science with precision manufacturing for reliable heat dissipation.Functioning as a Heat Pipe, the device implements two-phase cooling technology with thermal conductivities surpassing traditional solutions by 8x. The heat pipe variant features graded porosity wicks.Supporting Epoxy or Solder interface options, the system accommodates diverse assembly requirements. Push-pin versions enable tool-less installation for field serviceability.The Flat geometry is optimized for turbulent airflow conditions. Flat profiles demonstrate 25% better heat transfer in confined spaces.Incorporating Sintered fluid transport mechanisms, the capillary structure maintains consistent phase-change cycles. Composite wicks combine sintering and mesh for enhanced performance.Available in 5.906" (150.00mm) configurations, the modular design addresses thermal challenges across industries. The 200mm version is REACH compliant for global deployment.Precision-machined to 0.517" (13.14mm) tolerances, the contact surfaces ensure <0.005mm flatness. The 7.61mm variant is optimized for memory module cooling.With 0.394" (10.00mm) vertical clearance, the low-profile design fits slim industrial controllers. The 3.00mm version supports embedded computing applications.Fabricated from Copper substrates, the construction balances performance and cost. Aluminum versions offer 180 W/m K conductivity with 50% weight savings.
Product Attributes
- Product Status: Active
- Type: Heat Pipe
- Attachment Method: Epoxy or Solder
- Shape: Flat
- Power - Cooling: -
- Thermal Resistance: -
- Wick Type: Sintered
- Length: 5.906" (150.00mm)
- Width: 0.517" (13.14mm)
- Height: 0.394" (10.00mm)
- Diameter: -
- Operating Temperature: -
- Features: -
- Material: Copper
- Platform: -