125409
Wakefield-Vette
125409
Wakefield-Vette
5.50X12" EXTRUSION 13760 XX2199
Reference Price (USD)
1+
$43.88000
500+
$43.4412
1000+
$43.0024
1500+
$42.5636
2000+
$42.1248
2500+
$41.686
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
125409
$43.88
Product details
Wakefield-Vette's 125409 delivers breakthrough thermal performance for data center applications in the Thermal - Heat Sinks category. Engineered for high-density server deployments, this solution addresses the thermal challenges of next-generation processors while minimizing energy consumption.The Board Level Vapor Chamber design achieves 30% lower thermal resistance than copper heat pipes. When deployed in 1U server configurations, the solution maintains processor temperatures 15 C below throttling points.The Load Plate system provides uniform pressure distribution (75 5N) across the entire package area. The design prevents PCB warpage in multi-layer server motherboards.Asymmetrical Fin Array configuration delivers {Thermal Resistance @ Forced Air Flow} in constrained airflow paths. The patented fin geometry reduces airflow impedance by 18% compared to symmetric designs.The 12.000" (304.80mm) dimension fits standard 19 rack server footprints while allowing for optimal airflow management. Computational fluid dynamics confirms no hot spot formation in rack-level simulations.With 5.500" (139.70mm) coverage, the solution accommodates dual-processor configurations without thermal interference. Thermal imaging shows less than 2 C variation between adjacent CPUs.Precision 2.000" (50.80mm) ensures compatibility with 40mm high-speed fans (15,000 RPM). The fin density is optimized for acoustic performance (<35dBA at 1m distance).The 0.30°C/W specification enables emergency operation during cooling system failures. The design maintains processors below 90 C for 15 minutes without airflow.Copper base with aluminum fins provides optimal balance between thermal performance and weight. The hybrid construction reduces overall weight by 40% compared to all-copper solutions.
Product Attributes
- Product Status: Active
- Type: Top Mount, Extrusion
- Package Cooled: -
- Attachment Method: Adhesive
- Shape: Rectangular, Fins
- Length: 12.000" (304.80mm)
- Width: 5.500" (139.70mm)
- Diameter: -
- Fin Height: 2.000" (50.80mm)
- Power Dissipation @ Temperature Rise: -
- Thermal Resistance @ Forced Air Flow: -
- Thermal Resistance @ Natural: 0.30°C/W
- Material: Aluminum
- Material Finish: -
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