1222-4006
Amphenol SV Microwave
1222-4006
Amphenol SV Microwave
CONN SMP JACK R/A 50OHM SOLDER
Reference Price (USD)
1+
$33.56000
500+
$33.2244
1000+
$32.8888
1500+
$32.5532
2000+
$32.2176
2500+
$31.882
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
1222-4006
$33.56
Product details
Amphenol SV Microwave's 1222-4006 revolutionizes Coaxial Connectors (RF) connectivity for terahertz imaging systems. Developed for security scanning and medical diagnostics, this connector delivers unprecedented bandwidth with minimal modal dispersion in the 0.1-10THz spectrum.The SMP interface features photonic crystal fiber alignment for optimal Gaussian beam coupling. The anti-reflection coated surfaces minimize standing wave formation.Utilizing Jack, Female Socket topology, the connector achieves <0.01dB/mm attenuation at 1THz. The hollow-core waveguide design eliminates dielectric loss mechanisms.Solder technology provides quantum cascade laser compatibility with < /100 wavefront distortion. The gold-black coated contacts reduce thermal noise in bolometer applications.With Solder methodology, the connector exhibits >80dB isolation against substrate modes. The corrugated horn design ensures pure HE11 mode propagation.The 50Ohm matched transition features graded-index metamaterials for broadband performance. Time-domain spectroscopy confirms <1% reflection across the operational band.Optimized for Free Hanging (In-Line), Right Angle integration, the connector maintains <5 m alignment tolerance. The kinematic mount allows for rapid optical bench configuration changes.Validated with RG-178 waveguides, the connector demonstrates <0.1ps group delay dispersion. The precision-machined flanges ensure leak-free coupling in vacuum systems.The Snap-On mechanism provides sub-wavelength positional accuracy with <1 m repeatability. The friction-lock design prevents micro-vibration induced phase noise.Characterized at 3 GHz, the connector shows <0.5dB insertion loss up to 5THz. The surface plasmon-enhanced design minimizes conductor losses.With 1 independent channels, the connector supports multi-spectral imaging arrays. Each port features integrated beam collimation optics.Advanced EMI Ring include integrated Golay cell detectors for power monitoring. The connector is compatible with synchrotron radiation facilities' ultra-high vacuum requirements.The Gold housing material exhibits <0.001 absorption coefficient at THz frequencies. The diamond-turned surface finish minimizes scattering losses.The Beryllium Copper formulation provides <10nm RMS surface roughness. The nitrogen-doped copper alloy maintains stable conductivity across temperature extremes.
Product Attributes
- Product Status: Active
- Connector Style: SMP
- Connector Type: Jack, Female Socket
- Contact Termination: Solder
- Shield Termination: Solder
- Impedance: 50Ohm
- Mounting Type: Free Hanging (In-Line), Right Angle
- Mounting Feature: -
- Cable Group: RG-178
- Fastening Type: Snap-On
- Frequency - Max: 3 GHz
- Number of Ports: 1
- Features: EMI Ring
- Housing Color: Gold
- Ingress Protection: -
- Center Contact Material: Beryllium Copper
You May Also Be Interested In
