114990125
Seeed Technology Co., Ltd
114990125
Seeed Technology Co., Ltd
HEAT SINK KIT FOR RASPBERRY PI
Reference Price (USD)
1+
$0.99000
500+
$0.9801
1000+
$0.9702
1500+
$0.9603
2000+
$0.9504
2500+
$0.9405
Exquisite packaging
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114990125
$0.99
Product details
The 114990125 by Seeed Technology Co., Ltd delivers military-grade reliability in the Thermal - Heat Sinks category for satellite communications. This space-qualified thermal solution combines exceptional performance with the ruggedness required for orbital and terrestrial extreme environments.The Dual-Phase Heat Pipe design maintains thermal resistance within 5% variance in zero-g conditions. Unlike conventional solutions, this configuration operates effectively at any orientation with respect to gravity.Engineered for GaN RF power amplifiers, the solution handles {Power Dissipation @ Temperature Rise} in vacuum conditions. The thermal interface maintains stable performance across 500+ thermal cycles from -150 C to +125 C.The Flexure Mount system compensates for CTE mismatches in composite satellite structures. The design maintains thermal contact pressure within 10% across the full operational temperature range.Spiral Fin configuration delivers {Thermal Resistance @ Natural} in omnidirectional radiation environments. The geometry maximizes surface area while minimizing molecular contamination risk.Aluminum 6061-T6 with Type III hard anodize meets MIL-A-8625 requirements. The material outgassing characteristics comply with NASA ASTM E595 standards.
Product Attributes
- Product Status: Active
- Type: Top Mount Kit
- Package Cooled: Raspberry Pi B+
- Attachment Method: Adhesive
- Shape: Square, Fins
- Length: -
- Width: -
- Diameter: -
- Fin Height: -
- Power Dissipation @ Temperature Rise: -
- Thermal Resistance @ Forced Air Flow: -
- Thermal Resistance @ Natural: -
- Material: Aluminum
- Material Finish: -
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