110991328
Seeed Technology Co., Ltd
110991328
Seeed Technology Co., Ltd
HEAT SINK KIT FOR RASPBERRY PI 4
Reference Price (USD)
1+
$1.99000
500+
$1.9701
1000+
$1.9502
1500+
$1.9303
2000+
$1.9104
2500+
$1.8905
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
110991328
$1.99
Product details
The 110991328 from Seeed Technology Co., Ltd represents cutting-edge thermal management in the Thermal - Heat Sinks category. Engineered for high-performance computing applications, this solution delivers exceptional heat dissipation while maintaining compact form factors. With advanced materials engineering and precision manufacturing, it sets new benchmarks for thermal efficiency in demanding environments.The Top Mount design ensures optimal contact pressure distribution, critical for BGA and LGA package cooling. When compared to traditional skived designs, this extrusion-type heatsink reduces thermal interface resistance by up to 15%.Optimized for high-power ASICs and BGA packages, this solution addresses thermal challenges in 5G base stations and AI accelerator cards. The multi-surface contact architecture supports power dissipation up to {Power Dissipation @ Temperature Rise}.Featuring Push Pin and Thermal Tape options, the mounting system accommodates various PCB thicknesses (0.8-2.4mm). For mission-critical applications, the bolt-on version provides vibration resistance exceeding MIL-STD-810G standards.The Aluminum Alloy construction provides an ideal balance between thermal conductivity (180 W/m K) and weight considerations. For extreme environments, copper variants are available with optional nickel plating.
Product Attributes
- Product Status: Active
- Type: Top Mount Kit
- Package Cooled: Raspberry Pi 4B
- Attachment Method: Adhesive
- Shape: -
- Length: -
- Width: -
- Diameter: -
- Fin Height: -
- Power Dissipation @ Temperature Rise: -
- Thermal Resistance @ Forced Air Flow: -
- Thermal Resistance @ Natural: -
- Material: Aluminum
- Material Finish: -
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