110991327
Seeed Technology Co., Ltd
110991327
Seeed Technology Co., Ltd
HEAT SINK KIT FOR RASPBERRY PI 4
Reference Price (USD)
1+
$0.99000
500+
$0.9801
1000+
$0.9702
1500+
$0.9603
2000+
$0.9504
2500+
$0.9405
Exquisite packaging
Discount
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110991327
$0.99
Product details
The 110991327 from Seeed Technology Co., Ltd sets new benchmarks for thermal management in Thermal - Heat Sinks for consumer electronics. Designed for slim-profile devices, this solution delivers exceptional cooling performance while meeting stringent aesthetic and acoustic requirements.The Ultra-Thin Vapor Chamber design achieves just {Length} profile height while maintaining 25W/cm heat flux capacity. Compared to traditional heat spreaders, this solution reduces junction temperatures by up to 12 C.Optimized for mobile SoCs and GPU packages, the solution handles {Power Dissipation @ Temperature Rise} in 35 C ambient conditions. The thermal interface maintains performance through 1000+ power cycles.The Pressure-Sensitive Adhesive system allows for tool-less installation with consistent bond strength (3-5N/cm ). The adhesive maintains performance across -20 C to +85 C operating range.High-conductivity graphite laminate provides exceptional in-plane thermal conductivity (800 W/m K). The material is 40% lighter than equivalent aluminum solutions.
Product Attributes
- Product Status: Active
- Type: Top Mount Kit
- Package Cooled: Raspberry Pi 4B
- Attachment Method: Adhesive
- Shape: -
- Length: -
- Width: -
- Diameter: -
- Fin Height: -
- Power Dissipation @ Temperature Rise: -
- Thermal Resistance @ Forced Air Flow: -
- Thermal Resistance @ Natural: -
- Material: Aluminum
- Material Finish: -
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