110070016
Seeed Technology Co., Ltd
110070016
Seeed Technology Co., Ltd
RPI HEAT SINK KIT COPPER/ALUM
Reference Price (USD)
1+
$0.00000
500+
$0
1000+
$0
1500+
$0
2000+
$0
2500+
$0
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
110070016
$0.00
Product details
The 110070016 by Seeed Technology Co., Ltd revolutionizes thermal management in the Thermal - Heat Sinks sector, specifically tailored for renewable energy inverters. This advanced solution combines superior heat dissipation with rugged environmental protection, ensuring reliable performance in solar and wind power applications.The Top Mount Extruded design features optimized fin geometry that reduces thermal resistance by 22% compared to standard profiles. When subjected to IEC 60068-2-52 salt spray testing, the corrosion resistance exceeds 1000 hours.Designed for high-power IGBT modules, this solution handles {Power Dissipation @ Temperature Rise} in 85 C ambient conditions. The thermal interface maintains stability across 20,000+ power cycles, critical for solar farm operations.Hexagonal Pin Fin configuration achieves {Thermal Resistance @ Forced Air Flow} in multidirectional airflow environments. Computational analysis shows 15% better turbulence management than traditional square pin designs.Aluminum 6063-T6 alloy provides optimal balance between thermal conductivity (201 W/m K) and structural integrity. The material meets UL 94 V-0 flammability requirements.
Product Attributes
- Product Status: Obsolete
- Type: Heat Spreader Kit, Top Mount
- Package Cooled: Raspberry Pi
- Attachment Method: -
- Shape: Square
- Length: -
- Width: -
- Diameter: -
- Fin Height: -
- Power Dissipation @ Temperature Rise: -
- Thermal Resistance @ Forced Air Flow: -
- Thermal Resistance @ Natural: -
- Material: Aluminum, Copper
- Material Finish: -
You May Also Be Interested In
