10AS032E3F27E2SG
Intel
10AS032E3F27E2SG
Intel
IC SOC CORTEX-A9 1.5GHZ 672FBGA
Reference Price (USD)
1+
$1482.37000
500+
$1467.5463
1000+
$1452.7226
1500+
$1437.8989
2000+
$1423.0752
2500+
$1408.2515
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
10AS032E3F27E2SG
$1,482.37
Product details
Engineered for next-generation automotive electronics, Intel's 10AS032E3F27E2SG redefines Embedded - System On Chip (SoC) performance in vehicular applications. This advanced SoC combines automotive-grade reliability with sophisticated power management, making 10AS032E3F27E2SG the ideal choice for ADAS systems where signal integrity and functional safety are paramount.The dual-core MCU, FPGA architecture provides redundant processing paths that meet ASIL-D requirements for autonomous driving subsystems.Featuring the Dual ARM® Cortex®-A9 MPCore™ with CoreSight™, the device delivers the computational density needed for real-time sensor fusion while meeting stringent automotive power budgets.With 256KB of error-protected RAM, the processor maintains data coherence during sudden power fluctuations common in automotive environments.Automotive-specific DMA, POR, WDT include CAN-FD controllers and automotive Ethernet MACs, reducing the need for external interface chips.The comprehensive EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG suite supports in-vehicle network topologies while providing robust EMI performance essential for automotive applications.Operating at 1.5GHz, the processor meets the real-time processing requirements of high-resolution radar and lidar systems.FPGA - 320K Logic Elements include hardware security modules that provide cryptographic acceleration for secure vehicle-to-cloud communications.Qualified for 0°C ~ 100°C (TJ), the component maintains precise timing references across the full automotive temperature range.The 672-BBGA, FCBGA package features automotive-grade materials that withstand thermal shock and mechanical vibration.Available in 672-FBGA, FC (27x27), the device meets AEC-Q100 Grade 1 requirements for automotive electronics.
Product Attributes
- Product Status: Active
- Architecture: MCU, FPGA
- Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, POR, WDT
- Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.5GHz
- Primary Attributes: FPGA - 320K Logic Elements
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 672-BBGA, FCBGA
- Supplier Device Package: 672-FBGA, FC (27x27)
You May Also Be Interested In
