10AS032E2F27E1HG
Intel
10AS032E2F27E1HG
Intel
IC SOC CORTEX-A9 1.5GHZ 672FBGA
Reference Price (USD)
1+
$0.00000
500+
$0
1000+
$0
1500+
$0
2000+
$0
2500+
$0
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
10AS032E2F27E1HG
$0.00
Product details
Engineered for next-generation consumer electronics, Intel's 10AS032E2F27E1HG revolutionizes Embedded - System On Chip (SoC) performance in smart home devices. This advanced SoC combines powerful processing with intuitive user interfaces, making 10AS032E2F27E1HG ideal for voice-controlled assistants where audio signal processing and low-latency response are critical.The multi-core MCU, FPGA architecture enables simultaneous voice recognition, natural language processing, and wireless communication tasks.Featuring the Dual ARM® Cortex®-A9 MPCore™ with CoreSight™, the device delivers the computational power needed for real-time audio beamforming and noise cancellation algorithms.With 256KB of low-latency RAM, the processor ensures smooth performance during complex voice interaction scenarios.Consumer-focused DMA, POR, WDT include high-fidelity audio interfaces and touch controllers for seamless user experiences.The comprehensive EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG suite supports all major smart home protocols while maintaining robust wireless performance.Operating at 1.5GHz, the processor meets the real-time requirements of always-listening voice interfaces.FPGA - 320K Logic Elements include hardware-accelerated neural network processing for on-device AI capabilities.Rated for 0°C ~ 100°C (TJ), the component maintains reliable operation in various home environments.The 672-BBGA, FCBGA package enables sleek, compact designs without compromising thermal performance.Available in 672-FBGA, FC (27x27), the device supports high-volume consumer electronics manufacturing.
Product Attributes
- Product Status: Active
- Architecture: MCU, FPGA
- Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, POR, WDT
- Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.5GHz
- Primary Attributes: FPGA - 320K Logic Elements
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 672-BBGA, FCBGA
- Supplier Device Package: 672-FBGA, FC (27x27)
You May Also Be Interested In
