109X9812T0H016
Sanyo Denki America Inc.
109X9812T0H016
Sanyo Denki America Inc.
P4,CELERON,1.7-2.8GHZ,FC-PGA2
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Product details
Sanyo Denki America Inc.'s 109X9812T0H016 represents a quantum leap in Thermal - Heat Sinks technology for LED lighting applications. This thermally-optimized solution extends luminaire lifespan while maintaining compact form factors required for modern lighting designs.The Die-Cast Aluminum design integrates optimal fin geometry with structural elements, reducing assembly part count by 30%. Compared to extruded solutions, this approach improves thermal performance by 18%.Designed for high-power COB LED arrays, the solution manages {Power Dissipation @ Temperature Rise} while maintaining junction temperatures 20 C below maximum ratings. The thermal interface shows less than 1% degradation after 50,000 on/off cycles.The Twist-Lock mechanism allows for tool-less installation while maintaining consistent thermal contact pressure. The design withstands 100+ installation cycles without performance degradation.Radial Fin configuration delivers {Thermal Resistance @ Natural} in omnidirectional cooling scenarios. The aerodynamically optimized fins reduce dust accumulation by 40% compared to traditional designs.The 3.740" (95.00mm) dimension accommodates standard LED module sizes while providing sufficient thermal mass. The design prevents thermal shadowing in multi-source luminaires.With 3.606" (91.60mm) coverage, the solution provides uniform cooling for linear LED arrays. Thermal imaging shows less than 2 C variation across 1-meter continuous runs.Precision 2.460" (62.50mm) creates optimal natural convection currents while maintaining IP66 ingress protection. Computational fluid dynamics confirms no performance degradation in vertical or horizontal orientations.The 0.42°C/W performance remains stable in enclosed luminaires with limited airflow. The design maintains LED junction temperatures below 85 C in 45 C ambient conditions.ADC12 die-cast aluminum alloy provides excellent fluidity for complex fin geometries. The material meets UL 746B requirements for long-term thermal aging.
Product Attributes
- Product Status: Obsolete
- Type: Board Level
- Package Cooled: Pentium® III & Pentium® 4
- Attachment Method: Clip
- Shape: Rectangular
- Length: 3.740" (95.00mm)
- Width: 3.606" (91.60mm)
- Diameter: -
- Fin Height: 2.460" (62.50mm)
- Power Dissipation @ Temperature Rise: -
- Thermal Resistance @ Forced Air Flow: 0.42°C/W
- Thermal Resistance @ Natural: -
- Material: Aluminum, Plastic
- Material Finish: -
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