1071188

Phoenix Contact's 1071188 represents a breakthrough in Terminal Blocks - Wire to Board technology, specifically developed for next-generation 5G infrastructure. This terminal block combines high-speed signal integrity with robust power delivery, making it perfect for RF equipment and base station applications. The 510KBA-BAAG's innovative design addresses EMI shielding requirements while maintaining exceptional contact reliability.The 1 architecture allows parallel signal routing with minimal crosstalk. Multi-level configurations incorporate shielding partitions that reduce electromagnetic interference by 30dB at GHz frequencies.Engineered with 11 contacts per tier, this solution supports high-density interconnections. Each position features gold-plated contacts for consistent impedance matching across RF signal paths.The 0.150" (3.81mm) spacing maintains proper impedance control in matched-length signal bundles. Precision-molded slots prevent parallel conductor coupling above 6GHz.45° (135°) Angle with Board alignment facilitates optimal antenna feedline routing. The precision-angle design maintains 50 characteristic impedance throughout the connection path.Capable of handling 13.5 A load currents, the terminal block ensures uninterrupted power to RF amplifiers. Thermal simulations verify stable operation at 85 C ambient temperature with full load.The 160 V isolation rating meets stringent telecom safety standards. High-frequency dielectric materials minimize signal loss while providing arc flash protection.Through Hole configuration enhances grounding continuity for EMI control. Surface mount versions incorporate low-inductance grounding pads for effective noise suppression.The Screwless - Leg Spring, Push-In Spring technology ensures gas-tight connections for oxidation resistance. Automated insertion tools achieve <5m contact resistance variance across all terminated wires.Interlocking (Side), Lever Actuated include integrated ferrite bead slots for EMI filtering. The proprietary contact geometry reduces skin effect losses at millimeter-wave frequencies by 15%.Black housing provides visual RF hazard identification while offering UV resistance. The material formulation exhibits <0.5% moisture absorption for stable dielectric properties.